Техническая Спецификация для Intel 4 530 NE80546PG0801M

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The processor requires a thermal solution to maintain temperatures within operating limits as set 
forth in 

. Any attempt to operate the processor outside these operating limits may 

result in permanent damage to the processor and potentially other components within the system. 
As processor technology changes, thermal management becomes increasingly crucial when 
building computer systems. Maintaining the proper thermal environment is key to reliable, long-
term system operation.

A complete thermal solution includes both component and system level thermal management 
features. Component level thermal solutions can include active or passive heatsinks attached to the 
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of 
system fans combined with ducting and venting.

For more information on designing a component level thermal solution, refer to the Intel

 4 Processor on 90 nm Process Thermal Design Guidelines.

The boxed processor will ship with a component thermal solution. Refer to 

the boxed processor.

To allow for the optimal operation and long-term reliability of Intel processor-based systems, the 
system/processor thermal solution should be designed such that the processor remains within the 
minimum and maximum case temperature (T

C

) specifications when operating at or below the 

Thermal Design Power (TDP) value listed per frequency in 

. Thermal solutions not 

designed to provide this level of thermal capability may affect the long-term reliability of the 
processor and system. For more details on thermal solution design, refer to the Intel

Processor on 90 nm Process Thermal Design Guidelines.

The Pentium 4 processor on 90 nm process introduces a new methodology for managing processor 
temperatures that is intended to support acoustic noise reduction through fan speed control. 
Selection of the appropriate fan speed is based on the temperature reported by the processor’s 
Thermal Diode. If the diode temperature is greater than or equal to T

control

, then the processor case 

temperature must remain at or below the temperature as specified by the thermal profile. If the 
diode temperature is less than T

control

, then the case temperature is permitted to exceed the thermal 

profile, but the diode temperature must remain at or below T

control

. Systems that implement fan 

speed control must be designed to take these conditions into account. Systems that do not alter the 
fan speed only need to guarantee the case temperature meets the thermal profile specifications.