Техническая Спецификация для Intel 4 530 NE80546PG0801M

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The Thermal Monitor feature helps control the processor temperature by activating the TCC when 
the processor silicon reaches its maximum operating temperature. The TCC reduces processor 
power consumption as needed by modulating (starting and stopping) the internal processor core 
clocks. The Thermal Monitor feature must be enabled for the processor to be operating 
within specifications. The temperature at which Thermal Monitor activates the thermal control 
circuit is not user configurable and is not software visible. Bus traffic is snooped in the normal 
manner, and interrupt requests are latched (and serviced during the time that the clocks are on) 
while the TCC is active.

When the Thermal Monitor feature is enabled and a high temperature situation exists (i.e., TCC is 
active), the clocks are modulated by alternately turning the clocks off and on at a duty cycle 
specific to the processor (typically 30–50%). Clocks often will not be off for more than 
3.0 microseconds when the TCC is active. Cycle times are processor speed dependent and decrease 
as processor core frequencies increase. A small amount of hysteresis has been included to prevent 
rapid active/inactive transitions of the TCC when the processor temperature is near its maximum 
operating temperature. Once the temperature has dropped below the maximum operating 
temperature and the hysteresis timer has expired, the TCC goes inactive and clock modulation 
ceases.

With a properly designed and characterized thermal solution, it is anticipated that the TCC would 
only be activated for very short periods of time when running the most power intensive 
applications. The processor performance impact due to these brief periods of TCC activation is 
expected to be so minor that it would be immeasurable. An under-designed thermal solution that is 
not able to prevent excessive activation of the TCC in the anticipated ambient environment may 
cause a noticeable performance loss, and in some cases may result in a T

C

 that exceeds the 

specified maximum temperature and may affect the long-term reliability of the processor. In 
addition, a thermal solution that is significantly under-designed may not be capable of cooling the 
processor, even when the TCC is active continuously. Refer to the Intel

90 nm Process Thermal Design Guidelines for information on designing a thermal solution.

The duty cycle for the TCC, when activated by the Thermal Monitor, is factory configured and 
cannot be modified. The Thermal Monitor does not require any additional hardware, software 
drivers, or interrupt handling routines.