Техническая Спецификация для Microchip Technology GPIODM-KPLCD

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© 2007 Microchip Technology Inc.
DS21919E-page 33
MCP23008/MCP23S08
3.0
PACKAGING INFORMATION
3.1
Package Marking Information
18-Lead PDIP (300 mil)
18-Lead SOIC (300 mil)
20-Lead SSOP
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
Example:
Example:
Example:
MCP23008
0634256
MCP23008-E/P
^^
0634256
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
MCP23S08
XXXXXXXXXXXX
0634256
E/SO
^^
E/SS
^^
Legend: XX...X
Customer-specific information
Y
Year code (last digit of calendar year)
YY
Year code (last 2 digits of calendar year)
WW
Week code (week of January 1 is week ‘01’)
NNN
Alphanumeric traceability code
  
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (     )
can be found on the outer packaging for this package.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
3
e
3
e
3
e
20-Lead QFN
Example
XXXXX
XXXXXX
XXXXXX
YWWNNN
23S08
E/ML^^
0637
256
3
e