Техническая Спецификация для Microchip Technology GPIODM-KPLCD
MCP23008/MCP23S08
DS21919E-page 34
© 2007 Microchip Technology Inc.
18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
18
Pitch
e
.100 BSC
Top to Seating Plane
A
–
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.300
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.880
.900
.920
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.014
Upper Lead Width
b1
.045
.060
.070
Lower Lead Width
b
.014
.018
.022
Overall Row Spacing §
eB
–
–
.430
NOTE 1
N
E1
D
1
2
3
A
A1
A2
L
E
eB
c
e
b1
b
Microchip Technology Drawing C04-007B