Техническая Спецификация для Freescale Semiconductor Tower System Kit for MC9S08PT60 Series TWR-S08PT60-KIT TWR-S08PT60-KIT
Модели
TWR-S08PT60-KIT
Thermal specifications
5.3.1 Thermal characteristics
This section provides information about operating temperature range, power dissipation,
and package thermal resistance. Power dissipation on I/O pins is usually small compared
to the power dissipation in on-chip logic and voltage regulator circuits, and it is user-
determined rather than being controlled by the MCU design. To take P
and package thermal resistance. Power dissipation on I/O pins is usually small compared
to the power dissipation in on-chip logic and voltage regulator circuits, and it is user-
determined rather than being controlled by the MCU design. To take P
I/O
into account in
power calculations, determine the difference between actual pin voltage and V
SS
or V
DD
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin
current (heavy loads), the difference between pin voltage and V
current (heavy loads), the difference between pin voltage and V
SS
or V
DD
will be very
small.
Table 8. Thermal characteristics
Rating
Symbol
Value
Unit
Operating temperature range
(packaged)
T
A
-40 to 105
°C
Junction temperature range
T
J
-40 to 150
°C
Thermal resistance single-layer board
64-pin LQFP
θ
JA
71
°C/W
64-pin QFP
θ
JA
61
°C/W
48-pin LQFP
θ
JA
81
°C/W
44-pin LQFP
θ
JA
75
°C/W
32-pin LQFP
θ
JA
86
°C/W
Thermal resistance four-layer board
64-pin LQFP
θ
JA
53
°C/W
64-pin QFP
θ
JA
47
°C/W
48-pin LQFP
θ
JA
57
°C/W
44-pin LQFP
θ
JA
53
°C/W
32-pin LQFP
θ
JA
57
°C/W
The average chip-junction temperature (T
J
) in °C can be obtained from:
T
J
= T
A
+ (P
D
×
θ
JA
)
Where:
T
A
= Ambient temperature, °C
5.3
Thermal specifications
MC9S08PT60 Series Data Sheet, Rev. 3, 4/2012.
Freescale Semiconductor, Inc.
17