Техническая Спецификация для Quickcool Radio modules KEYFOB-MF1K-03ABS-BU
Модели
KEYFOB-MF1K-03ABS-BU
MF1S50YYX
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© NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PUBLIC
COMPANY PUBLIC
Rev. 3.0 — 2 May 2011
196330
29 of 39
NXP Semiconductors
MF1S50yyX
MIFARE Classic 1K - Mainstream contactless smart card IC
14.2 Package outline
For more details on the contactless modules MOA4 and MOA8 please refer to
and
Fig 21. Package outline SOT500-2
UNIT
D
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
35.05
34.95
34.95
For unspecified dimensions see PLLMC-drawing given in the subpackage code.
DIMENSIONS (mm are the original dimensions)
SOT500-2
03-09-17
06-05-22
06-05-22
- - -
- - -
- - -
PLLMC: plastic leadless module carrier package; 35 mm wide tape
SOT500-2
A
(1)
max.
0.33
0
10
20 mm
scale
A
detail X
X
Note
1. Total package thickness, exclusive punching burr.
D