Техническая Спецификация для Quickcool Radio modules KEYFOB-MF1K-03ABS-BU
Модели
KEYFOB-MF1K-03ABS-BU
MF1S50YYX
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© NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PUBLIC
COMPANY PUBLIC
Rev. 3.0 — 2 May 2011
196330
30 of 39
NXP Semiconductors
MF1S50yyX
MIFARE Classic 1K - Mainstream contactless smart card IC
Fig 22. Package outline SOT500-4
References
Outline
version
version
European
projection
projection
Issue date
IEC
JEDEC
JEITA
SOT500-4
- - -
- - -
- - -
sot500-4_po
11-02-18
Unit
mm
max
nom
nom
min
0.26 35.05
35.00
34.95
34.95
A
(1)
Dimensions
Note
1. Total package thickness, exclusive punching burr.
1. Total package thickness, exclusive punching burr.
PLLMC: plastic leadless module carrier package; 35 mm wide tape
SOT500-4
D
For unspecified dimensions see PLLMC-drawing given in the subpackage code.
0
10
20 mm
scale
X
D
detail X
A