Техническая Спецификация для Intel 1.40 GHz RH80532NC017256
Модели
RH80532NC017256
Mobile Intel
®
Celeron
®
Processor (0.13 µ)
Micro-FCBGA and Micro-FCPGA Packages Datasheet
298517-006 Datasheet
65
5. Mechanical
Specifications
5.1
Socketable Micro-FCPGA Package
The Mobile Intel Celeron Processor is packaged in a 478-pin Micro-FCPGA package. The Low Voltage
and Ultra Low Voltage processors will not be available in this package. The mechanical specifications
for the socketable package are provided in Table 43. Figure 25 through Figure 27 illustrate different
views of the package.
and Ultra Low Voltage processors will not be available in this package. The mechanical specifications
for the socketable package are provided in Table 43. Figure 25 through Figure 27 illustrate different
views of the package.
Table 43. Socketable Micro-FCPGA Package Specification
Symbol Parameter Min
Max
Unit
A
Overall height, top of die to package seating plane
1.81
2.03
mm
-
Overall height, top of die to PCB surface, including socket(1)
4.69
5.15
mm
A1 Pin
length
1.95
2.11
mm
A2 Die
height
0.854 mm
B Pin
diameter
0.28
0.36
mm
D
Package substrate length
34.9
35.1
mm
E Package
substrate
width
34.9
35.1
mm
D1 Die
length
11.18
3
10.82
4
mm
E1 Die
width
7.20
3
6.85
4
mm
e Pin
pitch
1.27
mm
K
Package edge keep-out
5
mm
K1 Package
corner
keep-out
7 mm
K3
Pin-side capacitor boundary
14
mm
-
Pin tip radial true position
<=0.254
mm
N Pin
count
478
each
Pdie
Allowable pressure on the die for thermal solution
-
689
kPa
W Package
weight
4.5
g
Package surface Flatness
0.286
mm
NOTES:
1. All dimensions are subject to change.
2. Overall height with socket is based on design dimensions of the Micro-FCPGA package and socket with no
2. Overall height with socket is based on design dimensions of the Micro-FCPGA package and socket with no
thermal solution attached. Values were based on design specifications and tolerances. This dimension is
subject to change based on socket design, OEM motherboard design, or OEM SMT process.
subject to change based on socket design, OEM motherboard design, or OEM SMT process.
3. Dimension for CPUID = 0x06B1.
4. Dimension for CPUID = 0x06B4.
4. Dimension for CPUID = 0x06B4.