Philips TZA3046 用户手册
TZA3046_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 19 May 2006
3 of 15
Philips Semiconductors
TZA3046
Fiber Channel/Gigabit Ethernet transimpedance amplifier
6.
Pinning information
6.1 Pinning
6.2 Pin description
Fig 2.
Pin configuration
001aae512
V
CC
IDREF_MON
AGC
OUTQ
OUT
GND
GND
V
CC
IDREF_MON
AGC
DREF
IPHOTO
DREF
OUT
OUTQ
GND
GND
3
1
17
4
16
5
15
6
12
9
11
10
2
7
8
14
13
TZA3046
Table 2:
Bonding pad description
Bonding pad locations with respect to the center of the die (see
µ
m.
Symbol
Pad X
Y
Type
Description
DREF
1
−
493.6
140
output
bias voltage output for PIN diode; connect cathode of PIN diode to
pad 1 or pad 3
pad 1 or pad 3
IPHOTO
2
−
493.6
0
input
current input; anode of PIN diode should be connected to this pad
DREF
3
−
493.6
−
140
output
bias voltage output for PIN diode; connect cathode of PIN diode to
pad 1 or pad 3
pad 1 or pad 3
V
CC
4
−
353.6
−
278.6
supply
supply voltage; connect supply voltage to pad 4 or pad 17
IDREF_MON
5
−
213.6
−
278.6
output
current output for RSSI measurements; connect a resistor to pad 5
or pad 16 and ground
or pad 16 and ground
AGC
6
−
73.6
−
278.6
input
AGC voltage; use pad 6 or pad 15
OUTQ
7
66.4
−
278.6
output
data output; complement of pad OUT; use pad 7 or pad 13
OUT
8
206.4
−
278.6
output
data output; use pad 8 or pad 14
GND
9
346.4
−
278.6
ground
ground; connect together pads 9, 10, 11 and pad 12 as many as
possible
possible
GND
10
486.4
−
278.6
ground
ground; connect together pads 9, 10, 11 and pad 12 as many as
possible
possible