Philips TZA3046 用户手册

TZA3046_1

© Koninklijke Philips Electronics N.V. 2006. All rights reserved.

[1]

These pads go HIGH when current flows into pad IPHOTO.

The TZA3046 is a TransImpedance Amplifier (TIA) intended for use in fiber optic receivers
for signal recovery in FC/GE or FTTx applications. It amplifies the current generated by a
photo detector (PIN diode or avalanche photodiode) and converts it to a differential output
voltage.

The most important characteristics of the TZA3046 are high receiver sensitivity, wide
dynamic range and large bandwidth. Excellent receiver sensitivity is achieved by
minimizing transimpedance amplifier noise.

The TZA3046 has a wide dynamic range to handle the signal current generated by the
PIN diode which can vary from 2.5

µ

A to 1.7 mA (p-p). This is implemented by an AGC

loop which reduces the preamplifier feedback resistance so that the amplifier remains
linear over the whole input range. The AGC loop hold capacitor is integrated on-chip, so
an external capacitor is not required.

The bandwidth of TZA3046 is optimized for FC/GE application. It works from DC onward
due to the absence of offset control loops. Therefore the amount of Consecutive Identical
Digits (CID) will not effect the output waveform. A differential amplifier converts the output
of the preamplifier to a differential voltage.

The performance of an optical receiver is largely determined by the combined effect of the
transimpedance amplifier and the PIN diode. In particular, the method used to connect the
PIN diode to the input (pad IPHOTO) and the layout around the input pad strongly
influences the main parameters of a transimpedance amplifier, such as sensitivity,
bandwidth, and PSRR.

Sensitivity is most affected by the value of the total capacitance at the input pad.
Therefore, to obtain the highest possible sensitivity the total capacitance should be as low
as possible.

GND

11

486.4

278.6

ground

ground; connect together pads 9, 10, 11 and pad 12 as many as
possible

GND

12

346.4

278.6

ground

ground; connect together pads 9, 10, 11 and pad 12 as many as
possible

OUTQ

13

206.4

278.6

output

data output; complement of pad OUT; use pad 7 or pad 13

OUT

14

66.4

278.6

output

data output; use pad 8 or pad 14

AGC

15

−

73.6

278.6

input

AGC voltage; use pad 6 or pad 15

IDREF_MON

16

−

213.6

278.6

output

current output for RSSI measurements; connect a resistor to pad 5
or pad 16 and ground

V

CC

17

−

353.6

278.6

supply

supply voltage; connect supply voltage to pad 4 or pad 17

 …continued

Bonding pad locations with respect to the center of the die (see

Figure 10

); X and Y are in

µ

m.