AMD SB750 用户手册

 

 
                                                                                                                                                                                                                                                                                                                                                             

 
 
 

 

As processor technology pushes to faster speeds and higher performance with increasing operation 
clock, thermal management becomes increasingly crucial while building computer systems. Maintaining 
the proper computing environment without thermal increasing is the key to reliable, stable, and 24 
hours system operation. The overall goal is keeping the processor below its specified maximum case 
temperature. Heatsinks induce improved processor heat dissipation through increasing surface area 
and concentrated airflow from attached active cooling fans. In addition, interface materials allow 
effective transfers of heat from the processor to the heatsink. For optimum heat transfer, AMD 
recommends the use of thermal grease and mounting clips to attach the heatsink to the processor.   

Please refer to the website below for collection of heatsinks evaluated and recommended for Socket 
AM2+ processors by AMD. In addition, this collection is not intended to be a comprehensive listing of 
all heatsinks that support Socket-AM2+ processors.