Nxp Semiconductors UM10237 用户手册
UM10237_2
© NXP B.V. 2008. All rights reserved.
User manual
Rev. 02 — 19 December 2008
6 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
•
Boundary scan for simplified board testing.
•
Versatile pin function selections allow more possibilities for using on-chip peripheral
functions.
functions.
4.
Applications
•
Industrial control
•
Medical systems
•
Protocol converter
•
Communications
5.
Ordering options
5.1 LPC2458 ordering options
5.2 LPC2460 ordering options
Table 3.
LPC2458 ordering information
Type number
Package
Name
Description
Version
LPC2458FET180
TFBGA180 plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-2
Table 4.
LPC2458 ordering options
Type number
Flash
(kB)
(kB)
SRAM (kB)
External
bus
bus
Ethernet
USB
OTG/
OHC/
DEV
+ 4 kB
FIFO
OTG/
OHC/
DEV
+ 4 kB
FIFO
CAN channels
SD/
MMC
MMC
GP
DMA
DMA
ADC channels
DAC channels
Temp
range
range
Lo
cal
bu
s
Et
hernet buffer
GP/
U
SB
RTC
To
ta
l
LPC2458FET180
512
64 16 16 2
98 16-bit
MII/
RMII
RMII
yes
2 yes
yes
8
1
−40 °C to
+85
+85
°C
Table 5.
LPC2420/60 ordering information
Type number
Package
Name
Description
Version
LPC2420FBD208 LQFP208
plastic low profile quad flat package; 208 leads; body 28
× 28 × 1.4 mm
SOT459-1
LPC2460FBD208 LQFP208
plastic low profile quad flat package; 208 leads; body 28
× 28 × 1.4 mm
SOT459-1
LPC2460FET208
TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15
× 15 × 0.7 mm SOT950-1