Intel QX9775 EU80574XL088N 数据表

产品代码

EU80574XL088N

Datasheet

Contents

Introduction.................................................................................................................9
1.1

Terminology ..................................................................................................... 10

1.2

References ....................................................................................................... 12

Electrical Specifications ............................................................................................... 13
2.1

Front Side Bus and GTLREF ................................................................................ 13

2.2

Power and Ground Lands.................................................................................... 13

2.3

Decoupling Guidelines........................................................................................ 14

2.4

Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 15

2.5

Voltage Identification (VID) ................................................................................ 17

2.6

Reserved, Unused, and Test Signals..................................................................... 19

2.7

Front Side Bus Signal Groups.............................................................................. 20

2.8

CMOS Asynchronous and Open Drain Asynchronous Signals .................................... 22

2.9

Test Access Port (TAP) Connection....................................................................... 22

Mechanical Specifications............................................................................................. 35
3.1

Package Mechanical Drawings ............................................................................. 35

3.2

Processor Component Keepout Zones................................................................... 39

3.3

Package Loading Specifications ........................................................................... 39

3.4

Package Handling Guidelines............................................................................... 40

3.5

Package Insertion Specifications.......................................................................... 40

3.6

Processor Mass Specifications ............................................................................. 40

3.7

Processor Materials............................................................................................ 40

3.8

Processor Markings............................................................................................ 41

3.9

Processor Land Coordinates ................................................................................ 42

Land Listing and Signal Description ............................................................................... 45
4.1

Land Listing...................................................................................................... 45

4.2

Signal Definitions .............................................................................................. 64

Thermal Specifications ................................................................................................ 75
5.1

Package Thermal Specifications........................................................................... 75

5.2

Processor Thermal Features ................................................................................ 78

5.3

Platform Environment Control Interface (PECI)...................................................... 81

Features.................................................................................................................... 85
6.1

Power-On Configuration Options.......................................................................... 85

6.2

Clock Control and Low Power States .................................................................... 85

6.3

Enhanced Intel SpeedStep® Technology .............................................................. 89