Nxp Semiconductors PBLS4004D 用户手册
PBLS4004D_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 6 January 2009
4 of 15
NXP Semiconductors
PBLS4004D
40 V PNP BISS loadswitch
6.
Thermal characteristics
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
2
.
[3]
Device mounted on a ceramic PCB, Al
2
O
3
, standard footprint.
(1) Ceramic PCB, Al
2
O
3
, standard footprint
(2) FR4 PCB, mounting pad for collector 1 cm
2
(3) FR4 PCB, standard footprint
Fig 1.
Power derating curves
T
amb
(
°
C)
0
160
120
40
80
006aaa461
0.4
0.2
0.6
0.8
P
tot
(W)
0
(1)
(2)
(3)
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Per device
R
th(j-a)
thermal resistance from
junction to ambient
junction to ambient
in free air
-
-
312
K/W
-
-
236
K/W
-
-
210
K/W
Per TR1; PNP low V
CEsat
transistor
R
th(j-sp)
thermal resistance from
junction to solder point
junction to solder point
-
-
105
K/W