Acer E3-1220 v3 KC.12201.3E3 用户手册

The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with

the motherboard using the LGA1150 socket. The package consists of a processor

mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to

the package substrate and core and serves as the mating surface for processor

thermal solutions, such as a heatsink. The following figure shows a sketch of the

processor package components and how they are assembled together.

The package components shown in the following figure include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors

The processor may contain components on the substrate that define component keep-

out zone requirements. A thermal and mechanical solution design must not intrude

into the required keep-out zones. Decoupling capacitors are typically mounted to the

land-side of the package substrate. Refer to the LGA1150 Socket Application Guide for

keep-out zones. The location and quantity of package capacitors may change due to

manufacturing efficiencies but will remain within the component keep-in. This keep-in

zone includes solder paste and is a post reflow maximum height for the components.

The following table provides dynamic and static load specifications for the processor

package. These mechanical maximum load limits should not be exceeded during

heatsink assembly, shipping conditions, or standard use condition. Also, any

Intel

®

 Xeon

®

 Processor E3-1200 v3 Product Family

June 2013

Datasheet – Volume 1 of 2

Order No.: 328907-001

101