Acer E3-1220 v3 KC.12201.3E3 用户手册

mechanical system or component testing should not exceed the maximum limits. The

processor package substrate should not be used as a mechanical reference or load-

bearing surface for thermal and mechanical solution.

Static Compressive Load

—

600 N [135 lbf]

1, 2, 3

Dynamic Compressive

Load

—

712 N [160 lbf]

1, 3, 4

Notes: 1. These specifications apply to uniform compressive loading in a direction normal to the processor,

IHS.

2. This is the maximum static force that can be applied by the heatsink and retention solution to

maintain the heatsink and processor interface.

3. These specifications are based on limited testing for design characterization. Loading limits are for

the package only and do not include the limits of the processor socket.

4. Dynamic loading is defined as an 50g shock load, 2X Dynamic Acceleration Factor with a 500g

maximum thermal solution.

The following table includes a list of guidelines on package handling in terms of

recommended maximum loading on the processor IHS relative to a fixed substrate.

These package handling loads may be experienced during heatsink removal.

Shear

311 N [70 lbf]

1, 4

Tensile

111 N [25 lbf]

2, 4

Torque

3.95 N-m [35 lbf-in]

3, 4

Notes: 1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.

2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS

surface.

3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the

IHS top surface.

4. These guidelines are based on limited testing for design characterization.

The processor can be inserted into and removed from an LGA1150 socket 15 times.

The socket should meet the LGA1150 socket requirements detailed in the LGA1150

Socket Application Guide.

The typical mass of the processor is 27.0 g (0.95 oz). This mass [weight] includes all

the components that are included in the package.

The following table lists some of the package components and associated materials.

Intel

®

 Xeon

®

 Processor E3-1200 v3 Product Family

Datasheet – Volume 1 of 2

June 2013

102

Order No.: 328907-001