Fujifilm Xeon DP S26361-F3310-L280 数据表
产品代码
S26361-F3310-L280
Datasheet
3
Contents
Introduction....................................................................................................................................9
Terminology ........................................................................................................................ 10
Electrical Specifications ............................................................................................................. 13
Power and Ground Pins...................................................................................................... 13
Decoupling Guidelines ........................................................................................................13
2.2.1
2.2.1
Decoupling ..................................................................................................... 13
Decoupling ..................................................................................................... 13
Front Side Bus AGTL+ Decoupling........................................................................ 14
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ...............................................14
2.3.1
2.3.1
Voltage Identification (VID) .................................................................................................16
Reserved or Unused Pins ................................................................................................... 18
Front Side Bus Signal Groups ............................................................................................19
GTL+ Asynchronous and AGTL+ Asynchronous Signals ................................................... 22
Test Access Port (TAP) Connection ................................................................................... 22
Mixing Processors .............................................................................................................. 22
Absolute Maximum and Minimum Ratings .........................................................................23
Processor DC Specifications .............................................................................................. 24
2.11.1 VCC Overshoot Specification ................................................................................ 30
2.11.2 Die Voltage Validation ........................................................................................... 31
2.11.1 VCC Overshoot Specification ................................................................................ 30
2.11.2 Die Voltage Validation ........................................................................................... 31
Mechanical Specifications .......................................................................................................... 35
Signal Definitions ....................................................................................................................... 43
Pin List.......................................................................................................................................... 53
®
Xeon™ Processor with 800 MHz System Bus Pin Assignments ......... 53
Thermal Specifications .............................................................................................................. 71
Package Thermal Specifications ........................................................................................ 71
6.1.1
6.1.1
Thermal Specifications ..........................................................................................71