Freescale Semiconductor FRDM-FXS-MULTI-B 数据表

Sensors

92

Freescale Semiconductor, Inc.

Junction-to-ambient, natural convection

(1)(2)

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, 

ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

2. Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.

Single-layer board

R

θ

JA

163

°C/W

Junction-to-ambient, natural convection

(1)(3)

3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

Four-layer board (two signals, two planes)

70

Junction-to-board

(4)

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface 

of the board near the package.

R

θ

JB

33

°C/W

Junction-to-case (top)

(5)

 

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).

R

θ

JCTop

84

°C/W

Junction-to-package (top)

(6)

6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC 

JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Natural convection

Ψ

JT

6

°C/W