Freescale Semiconductor StarterTRAK USB for Automotive Applications TRK-USB-MPC5604B TRK-USB-MPC5604B TRK-USB-MPC5604B 数据表

产品代码
TRK-USB-MPC5604B
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页码 109
Package pinouts and signal descriptions
 MPC5604B/C Microcontroller Data Sheet, Rev. 11.1
Freescale Semiconductor
35
3.14
Thermal characteristics
3.14.1
Package thermal characteristics
Table 14. LQFP thermal characteristics
1
 
1
Thermal characteristics are based on simulation.
Symbol
C
Parameter
Conditions
2
Pin count Value
Unit
R
JA
CC
D
Thermal resistance, 
junction-to-ambient natural 
convection
3
Single-layer board - 1s
64
60
°C/W
100
64
144
64
Four-layer board - 2s2p
64
42
100
51
144
49
R
JB
CC
D
Thermal resistance, 
junction-to-board
4
Single-layer board - 1s
64
24
°C/W
100
36
144
37
Four-layer board - 2s2p
64
24
100
34
144
35
R
JC
CC
D
Thermal resistance, 
junction-to-case
5
Single-layer board - 1s
64
11
°C/W
100
22
144
22
Four-layer board - 2s2p
64
11
100
22
144
22
JB
CC
D
Junction-to-board thermal 
characterization parameter, 
natural convection
Single-layer board - 1s
64
TBD
°C/W
100
33
144
34
Four-layer board - 2s2p
64
TBD
100
34
144
35
JC
CC
D
Junction-to-case thermal 
characterization parameter, 
natural convection
Single-layer board - 1s
64
TBD
°C/W
100
9
144
10
Four-layer board - 2s2p
64
TBD
100
9
144
10