Analog Devices ADP2291 Evaluation Board ADP2291RM-EVALZ ADP2291RM-EVALZ 数据表
产品代码
ADP2291RM-EVALZ
ADP2291
Rev. A | Page 17 of 20
OUTLINE DIMENSIONS
1
0.50
BSC
0.60 MAX
PIN 1
INDICATOR
INDICATOR
1.50
REF
REF
0.50
0.40
0.30
0.40
0.30
2.75
BSC SQ
TOP
VIEW
12° MAX
0.70 MAX
0.65 TYP
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
0.90 MAX
0.85 NOM
0.85 NOM
0.30
0.23
0.18
0.23
0.18
0.05 MAX
0.01 NOM
0.01 NOM
0.20 REF
1.89
1.74
1.59
1.74
1.59
4
1.60
1.45
1.30
1.45
1.30
3.00
BSC SQ
5
8
Figure 28. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm x 3 mm Body, Very Thin, Dual Lead
(CP-8-2)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.80
0.60
0.40
0.60
0.40
8°
0°
0°
4
8
1
5
PIN 1
0.65 BSC
SEATING
PLANE
PLANE
0.38
0.22
0.22
1.10 MAX
3.20
3.00
2.80
3.00
2.80
COPLANARITY
0.10
0.23
0.08
0.08
3.20
3.00
2.80
3.00
2.80
5.15
4.90
4.65
4.90
4.65
0.15
0.00
0.00
0.95
0.85
0.75
0.85
0.75
Figure 29. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
Branding
ADP2291ARMZ-R7
−40°C to +85°C
8-Lead MSOP
RM-8
P08
ADP2291ACPZ-R7
−40°C to +85°C
8-Lead LFCSP_VD
CP-8-2
P08
ADP2291-EVAL
Evaluation
Board
1
Z = Pb-free part.