Nxp Semiconductors OM11043 数据表
LPC1769_68_67_66_65_64_63
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Product data sheet
Rev. 9.5 — 24 June 2014
79 of 89
NXP Semiconductors
LPC1769/68/67/66/65/64/63
32-bit ARM Cortex-M3 microcontroller
Fig 41. Package outline SOT926-1 (TFBGA100)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
SOT926-1
- - -
- - -
- - -
SOT926-1
05-12-09
05-12-22
05-12-22
UNIT
A
max
mm
1.2
0.4
0.3
0.3
0.8
0.65
0.5
0.4
0.4
9.1
8.9
8.9
9.1
8.9
8.9
A
1
DIMENSIONS (mm are the original dimensions)
TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
A
2
b
D
E
e
2
7.2
e
0.8
e
1
7.2
v
0.15
w
0.05
y
0.08
y
1
0.1
0
2.5
5 mm
scale
b
e
2
e
1
e
e
1/2 e
1/2 e
A
C
B
∅
v
M
C
∅
w
M
ball A1
index area
index area
A
B
C
D
E
F
H
K
G
J
2
4
6
8
10
1
3
5
7
9
ball A1
index area
index area
B
A
E
D
C
y
C
y
1
X
detail X
A
A
1
A
2