Nxp Semiconductors OM11043 数据表
LPC1769_68_67_66_65_64_63
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Product data sheet
Rev. 9.5 — 24 June 2014
81 of 89
NXP Semiconductors
LPC1769/68/67/66/65/64/63
32-bit ARM Cortex-M3 microcontroller
17. Soldering
Fig 43. Reflow soldering for the LQFP100 package
SOT407-1
DIMENSIONS in mm
occupied area
Footprint information for reflow soldering of LQFP100 package
Ax
Bx
Gx
Gy
Hy
Hx
Ay
By
P1
P2
D2 (8
×
)
D1
(0.125)
Ax
Ay
Bx
By
D1
D2
Gx
Gy
Hx
Hy
P1
P2
C
sot407-1
solder land
C
Generic footprint pattern
Refer to the package outline drawing for actual layout
17.300 17.300 14.300 14.300
0.500
0.560
0.280
1.500
0.400
14.500 14.500 17.550 17.550