Intel 4 HT 631 80552PG0802M2M 数据表
产品代码
80552PG0802M2M
Datasheet
19
Electrical Specifications
VTT_OUT_LEFT
and
VTT_OUT_RIGHT
I
and
VTT_OUT_RIGHT
I
CC
DC Current that may be drawn from
VTT_OUT_LEFT and VTT_OUT_RIGHT per
pin
VTT_OUT_LEFT and VTT_OUT_RIGHT per
pin
—
—
580
mA
I
TT
Steady-state FSB termination current
—
—
3.5
A
15, 16
I
TT_P
OWER
-
UP
Power-up FSB termination current
—
—
4.5
A
, 17
I
CC_VCCA
I
CC
for PLL lands
—
—
35
mA
I
CC_VCCIOPLL
I
CC
for I/O PLL land
—
—
26
mA
I
CC_GTLREF
I
CC
for GTLREF
—
—
200
µA
NOTES:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Adherence to the voltage specifications for the processor are required to ensure reliable processor operation.
3. Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and can
not be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same
frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor
during a power management event (Thermal Monitor 2, Enhanced Intel SpeedStep technology, or Enhanced HALT State).
4.
These voltages are targets only. A variable voltage source should exist on systems in the event that a different
voltage is required. See
and
for more information.
5. The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the socket with a 100 MHz
bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1 M
Ω minimum impedance. The maximum length of ground
wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
6.
Refer to
and
for the minimum, typical, and maximum V
CC
allowed for a given current. The
processor should not be subjected to any V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
for a given
current.
7. I
CC_MAX
is specified at V
CC_MAX
.
8. The current specified is also for AutoHALT State.
9. I
CC
Stop-Grant is specified at V
CC_MAX
.
10.I
SGNT
and I
ENHANCED_AUTO_HALT
are specified at V
CC_TYP
and TC = 50 °C.
11.These parameters are based on design characterization and are not tested.
12.The maximum instantaneous current the processor will draw while the thermal control circuit is active (as indicated by the
assertion of PROCHOT#) is the same as the maximum I
CC
for the processor.
13.V
TT
must be provided via a separate voltage source and not be connected to V
CC
. This specification is measured at the land.
14.Baseboard bandwidth is limited to 20 MHz.
15.
This is maximum total current drawn from V
TT
plane by only the processor. This specification does not include
the current coming from R
TT
(through the signal line). Refer to the
Voltage Regulator-Down (VRD) 10.1 Design Guide
For Desktop and Transportable LGA775 Socket
to determine the total I
TT
drawn by the system.
16.This is a steady-state I
TT
current specification, which is applicable when both V
TT
and V
CC
are high.
17.This is a power-up peak current specification that is applicable when V
TT
is high and V
CC
is low.
Table 4.
Voltage and Current Specification
Symbol
Parameter
Min
Typ
Max
Unit
Notes
1, 2