Intel Core i7 Processor Extreme Edition I7-965 AT80601000918AA 用户手册

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Datasheet 

. The temperature reported over PECI is always a negative value and 

represents a delta below the onset of thermal control circuit (TCC) activation, as 
indicated by PROCHOT# (see 

, Processor Thermal Features). Systems that 

implement fan speed control must be designed to use this data. Systems that do not 
alter the fan speed only need to guarantee the thermal solution provides the Ψ

CA

 that 

meets the TTV thermal profile specifications.

A single integer change in the PECI value corresponds to approximately 1 °C change in 
processor temperature. Although each processors DTS is factory calibrated, the 
accuracy of the DTS will vary from part to part and may also vary slightly with 
temperature and voltage. In general, each integer change in PECI should equal a 
temperature change between 0.9 °C and 1.1 °C.

Analysis indicates that real applications are unlikely to cause the processor to consume 
maximum power dissipation for sustained time periods. Intel recommends that 
complete thermal solution designs target the Thermal Design Power (TDP), instead of 
the maximum processor power consumption. The Adaptive Thermal Monitor feature is 
intended to help protect the processor in the event that an application exceeds the TDP 
recommendation for a sustained time period. For more details on this feature, refer to 

. Refer to the appropriate processor Thermal and Mechanical Design Guide 

(see 

) for details on system thermal solution design, thermal profiles and 

environmental considerations.

1.

These values are specified at V

CC_MAX

 for all processor frequencies. Systems must be designed to ensure 

the processor is not to be subjected to any static V

CC

 and I

CC

 combination wherein V

CC

 exceeds V

CC_MAX

 at 

specified I

CC

. Refer to the loadline specifications in 

.

2.

Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the 

maximum power that the processor can dissipate. TDP is measured at the TCC activation temperature.

3.

These specifications are based on initial silicon characterization. These specifications may be further 

updated as more characterization data becomes available.

4.

Power specifications are defined at all VIDs found in 

. The processor may be shipped under 

multiple VIDs for each frequency.

5.

Target Ψ-ca Using the processor TTV (°C/W) is based on a T

AMBIENT 

of 39 °C.

6.

Processor idle power is specified under the lowest possible idle state: processor package C6 state. 

Achieving processor package C6 state is not supported by all chipsets. See Intel X58 Express Chipset 

specifications for more details.

i7-965
i7-940
i7-920

3.20 GHz
2.93 GHz
2.66 GHz

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130
130

12
12
15

5
5
5

See 

; 

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