CyberpowerPC Microphone MPC603EC 用户手册

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页码 30
 
4
603 Hardware Specifications, REV 2
 
Preliminary—Subject to Change without Notice
 
 
 
1.2  General Parameters
 
The following list provides a summary of the general parameters of the 603.
Technology
0.5 
 
µ
 
 CMOS (four-layer metal)
Die size
11.5 mm x 7.4 mm
Transistor count
1.6 million
Logic design
Fully-static
Max. internal frequency
80 MHz
Max. bus frequency
66.67 MHz
Package
Surface mount, 240-pin CQFP
Power supply
3.3 
 
±
 
 5% V dc
 
1.3  Electrical and Thermal Characteristics
 
This section provides both the AC and DC electrical specifications and thermal characteristics for the 603.
The following specifications are preliminary and subject to change without notice.
 
1.3.1  DC Electrical Characteristics
 
Table 1 and Table 2 provide the absolute maximum ratings, thermal characteristics, and DC electrical
characteristics for the 603.
 
Table 1. Absolute Maximum Ratings
 
Characteristic
Symbol
Value
Unit
 
Supply voltage
Vdd
–0.3 to 4.0
V
Input voltage
Vin
–0.3 to 5.5
V
Storage temperature range
Tstg
–55 to 150
 
°
 
C
 
Notes
 
: 1. Functional operating conditions are given in AC and DC electrical specifications. Stresses beyond the 
maximum listed may affect device reliability or cause permanent damage to the device.
2. 
 
Caution
 
: Input voltage must not be greater than the supply voltage by more than 2.5 V at all times 
including during power-on reset.
 
Table 2. Thermal Characteristics
 
Characteristic
Symbol
Value
Rating
 
Motorola wire-bond CQFP package thermal resistance, 
junction-to-case (typical)
 
 
θ
 
JC
 
 
 
2.2
 
°
 
C/W
IBM C4-CQFP package thermal resistance,
junction-to-heat sink base
 
θ
 
JS
1.1
 
°
 
C/W
 
Note: 
 
Refer to Section 1.7, “System Design Information,” for more information about thermal management.