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603 Hardware Specifications, REV 2
5
 
Preliminary—Subject to Change without Notice
 
 
 
Table 3 provides the DC electrical characteristics for the 603.
Table 4 provides the power dissipation for the 603.
 
Table 3. DC Electrical Specifications
 
  
 
Vdd = 3.3 
 
±
 
 5% V dc, GND = 0 V dc, 0 
 
 
 T
 
 
 
 105 
 
°
 
C
 
Characteristic
Symbol
Min
Max
Unit
 
Input high voltage (all inputs except SYSCLK)
VIH
2.2
5.5
V
Input low voltage (all inputs except SYSCLK)
VIL
GND
0.8
V
SYSCLK input high voltage
CVIH
2.4
5.5
V
SYSCLK input low voltage
CVIL
GND
0.4
V
Input leakage current, Vin = 3.465 V
 
1
 
Vin = 5.5 V
 
1
 
Iin
10
 
µ
 
A
Iin
TBD
 
µ
 
A
Hi-Z (off-state) leakage current, Vin
 
 = 
 
3.465 V
 
1
 
Vin
 
 = 
 
5.5
 
 
 
V
 
1
 
ITSI
10
 
µ
 
A
ITSI
TBD
 
µ
 
A
Output high voltage, IOH
 
 = –9 
 
mA
VOH
2.4
V
Output low voltage, IOL
 
 = 1 4  
 
mA
VOL
0.4
V
Capacitance, Vin = 0 V, f = 1 MHz
 
2
 
 (excludes TS, ABB, 
DBB, and ARTRY)
Cin
10.0
pF
Capacitance, Vin = 0 V, f = 1 MHz
 
2
 
 (for TS, ABB, DBB, and 
ARTRY)
Cin
15.0
pF
 
Notes
 
: 1. Excludes test signals (LSSD_MODE, L1_TSTCLK, L2_TSTCLK, and JTAG signals). For detailed 
leakage information, please contact your local Motorola or IBM sales office.
2. Capacitance is periodically sampled rather than 100% tested.
 
Table 4. Power Dissipation 
 
Vdd = 3.3 
 
±
 
 5% V dc, GND = 0 V dc, 0 
 
 
 T
 
 
 
 105 
 
°
 
C
 
CPU Clock:
SYSCLK
Bus Frequency (SYSCLK)
Unit
25 MHz
33 MHz
40 MHz
50 MHz
66 MHz
Full-On Mode
 
Typical
1:1
Max.
1.8
W
2.5
W
Typical
2:1
Max.
1.8
2.0
W
2.5
2.9
W
 
Doze Mode
 
1
 
1:1
Typical
740
mW
2:1
Typical
745
800
mW