用户手册 — AMPAK Technology Inc. WSDT752BSC

目录

• 1. Introduction

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• 1.1 DESCRIPTION

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• 1.2 APPLICATIONS

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• 2. FEATURES

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• 3. General Specification

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• 3.1 General Specification

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• 3.2 Voltages

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• 3.2.1 Absolute Maximum Ratings

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• 3.2.2 Recommended Operating Ratings

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• 3.3 Power Consumption

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• 3.3.1 BLE Power Consumption

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• 4. Main CPU Overview

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• 4.1 CM3 Features

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• 5. RF Specification

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• 5.1 BLE Specification

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• 6. Ceramic Chip Antenna Specification

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• 6.1 Description Value

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• 7. Pinout Information

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• 7.1 Schematic Diagram

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• 7.2 Pin Descriptions

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• 7.3 Pin Number Define

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• 8. Software Overview

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• 8.1 Software tool installation

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• 8.2 WSDT-752B_SC board GPIO configuration file path

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• 8.3 PIN define in header file Board.h

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• 9. Module Dimensions

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• (Unit: mm)

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• (Unit: mm)

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• 10. Recommended Reflow Profile

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• 11. Label Drawing

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• 12. Packing Information

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• 12.1 Packing Dimension

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• 13.Statement

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• 13.1 FCC Statement:

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• 13.2 ISED Statement:

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• 13.3 FCC Label Instructions

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