Benutzerhandbuch für AMPAK Technology Inc. WSDT752BSC

Inhaltsverzeichnis

• 1. Introduction

  1
• 1.1 DESCRIPTION

  1
• 1.2 APPLICATIONS

  1
• 2. FEATURES

  2
• 3. General Specification

  4
• 3.1 General Specification

  4
• 3.2 Voltages

  4
• 3.2.1 Absolute Maximum Ratings

  4
• 3.2.2 Recommended Operating Ratings

  4
• 3.3 Power Consumption

  5
• 3.3.1 BLE Power Consumption

  5
• 4. Main CPU Overview

  6
• 4.1 CM3 Features

  6
• 5. RF Specification

  7
• 5.1 BLE Specification

  7
• 6. Ceramic Chip Antenna Specification

  10
• 6.1 Description Value

  10
• 7. Pinout Information

  11
• 7.1 Schematic Diagram

  11
• 7.2 Pin Descriptions

  11
• 7.3 Pin Number Define

  13
• 8. Software Overview

  14
• 8.1 Software tool installation

  14
• 8.2 WSDT-752B_SC board GPIO configuration file path

  14
• 8.3 PIN define in header file Board.h

  14
• 9. Module Dimensions

  15
• (Unit: mm)

  15
• (Unit: mm)

  18
• 10. Recommended Reflow Profile

  19
• 11. Label Drawing

  20
• 12. Packing Information

  21
• 12.1 Packing Dimension

  21
• 13.Statement

  22
• 13.1 FCC Statement:

  22
• 13.2 ISED Statement:

  22
• 13.3 FCC Label Instructions

  23