用户手册 (HMT351S6CFR8C-PB)目录Description3Fetures3Ordering Information3Key Parameters4Speed Grade4Address Table4Pin Descriptions5Input/Output Functional Descriptions6Pin Assignments8Functional Block Diagram92GB, 256Mx64 Module(1Rank of x8)94GB, 512Mx64 Module(2Rank of x8)10Absolute Maximum Ratings11Absolute Maximum DC Ratings11DRAM Component Operating Temperature Range11AC & DC Operating Conditions12Recommended DC Operating Conditions12AC & DC Input Measurement Levels13AC and DC Input Levels for Single-Ended Command and Address Signals13AC and DC Input Levels for Single-Ended Signals14Vref Tolerances15AC and DC Logic Input Levels for Differential Signals16Differential signal definition16Differential swing requirements for clock (CK - CK) and strobe (DQS-DQS)17Single-ended requirements for differential signals18Differential Input Cross Point Voltage19Slew Rate Definitions for Single-Ended Input Signals20Slew Rate Definitions for Differential Input Signals21AC & DC Output Measurement Levels22Single Ended AC and DC Output Levels22Differential AC and DC Output Levels22Single Ended Output Slew Rate23Differential Output Slew Rate24Reference Load for AC Timing and Output Slew Rate25Overshoot and Undershoot Specifications26Address and Control Overshoot and Undershoot Specifications26Clock, Data, Strobe and Mask Overshoot and Undershoot Specifications27Refresh parameters by device density28Standard Speed Bins29DDR3-800 Speed Bins29DDR3-1066 Speed Bins30DDR3-1333 Speed Bins31DDR3-1600 Speed Bins32Speed Bin Table Notes33IDD and IDDQ Specification Parameters and Test Conditions34IDD Specifications (Tcase: 0 to 95oC)462GB, 256M x 64 SO-DIMM: HMT325S6CFR8C464GB, 512M x 64 SO-DIMM: HMT351S6CFR8C46Module Dimensions47256Mx64 - HMT325S6CFR8C47512Mx64 - HMT351S6CFR8C48文件大小： 974.1 KB页数： 48Language: English打开用户手册
