用户手册 — Intel Pentium D 940

目录

• Contents Contents

  3
  • Figures

    5
  • Tables

    6
• Revision History Revision History

  7
• Intel® Pentium® D Processor 900 Sequence and Intel® Pentium® Processor Extreme Edition 955, 965 Features

  9
• Intel® Pentium® D Processor 900D Sequence and Intel® Pentium® Processor Extreme Edition 955D, 965D

  1
• 1 Introduction

  11
  • 1.1 Terminology

    12
    • 1.1.1 Processor Packaging Terminology

      12
  • 1.2 References

    13
    • Table 1. References

      13
• 2 Electrical Specifications

  15
  • 2.1 Power and Ground Lands

    15
  • 2.2 Decoupling Guidelines

    15
    • 2.2.1 VCC Decoupling

      15
    • 2.2.2 VTT Decoupling

      15
    • 2.2.3 FSB Decoupling

      16
  • 2.3 Voltage Identification

    16
    • Table 2. Voltage Identification Definition

      17
  • 2.4 Reserved, Unused, and TESTHI Signals

    18
  • 2.5 Voltage and Current Specification

    19
    • 2.5.1 Absolute Maximum and Minimum Ratings

      19
      • Table 3. Absolute Maximum and Minimum Ratings

        19
    • 2.5.2 DC Voltage and Current Specification

      20
      • Table 4. Voltage and Current Specifications

        20
      • Table 5. VCC Static and Transient Tolerance for 775_VR_CONFIG_05A (Mainstream) and 775_VR_CONFIG_05B (Performance) Processors

        23
      • Figure 1. VCC Static and Transient Tolerance for 775_VR_CONFIG_05A (Mainstream) and 775_VR_CONFIG_05B (Performance) Processors

        24
    • 2.5.3 VCC Overshoot

      24
      • Table 6. VCC Overshoot Specifications1,2

        24
      • Figure 2. VCC Overshoot Example Waveform

        25
    • 2.5.4 Die Voltage Validation

      25
  • 2.6 Signaling Specifications

    25
    • 2.6.1 FSB Signal Groups

      26
      • Table 7. FSB Signal Groups (Sheet 2 of 2)

        26
      • Table 8. Signal Characteristics

        27
      • Table 9. Signal Reference Voltages

        27
    • 2.6.2 GTL+ Asynchronous Signals

      28
    • 2.6.3 Processor DC Specifications

      28
      • Table 10. GTL+ Signal Group DC Specifications

        28
      • Table 11. GTL+ Asynchronous Signal Group DC Specifications

        29
      • Table 12. TAP Signal Group DC Specifications

        29
      • Table 13. VTTPWRGD DC Specifications

        30
      • Table 14. BSEL[2:0] and VID[5:0] DC Specifications

        30
      • Table 15. MSID [1,0] and BOOTSELECT DC Specifications

        30
      • 2.6.3.1 GTL+ Front Side Bus Specifications

        31
        • Table 16. GTL+ Bus Voltage Definitions

          31
  • 2.7 Clock Specifications

    32
    • 2.7.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking

      32
      • Table 17. Core Frequency to FSB Multiplier Configuration

        32
    • 2.7.2 FSB Frequency Select Signals (BSEL[2:0])

      32
      • Table 18. BSEL[2:0] Frequency Table for BCLK[1:0]

        33
    • 2.7.3 Phase Lock Loop (PLL) and Filter

      33
      • Figure 3. Phase Lock Loop (PLL) Filter Requirements

        34
    • 2.7.4 BCLK[1:0] Specifications

      35
      • Table 19. Front Side Bus Differential BCLK Specifications

        35
• 3 Package Mechanical Specifications

  37
  • Figure 4. Processor Package Assembly Sketch

    37
  • 3.1 Package Mechanical Drawing

    37
    • Figure 5. Processor Package Drawing Sheet 1 of 3

      38
    • Figure 6. Processor Package Drawing Sheet 2 of 3

      39
    • Figure 7. Processor Package Drawing Sheet 3 of 3

      40
  • 3.2 Processor Component Keep-Out Zones

    41
  • 3.3 Package Loading Specifications

    41
    • Table 20. Processor Loading Specifications

      41
  • 3.4 Package Handling Guidelines

    41
    • Table 21. Package Handling Guidelines

      41
  • 3.5 Package Insertion Specifications

    41
  • 3.6 Processor Mass Specification

    42
  • 3.7 Processor Materials

    42
    • Table 22. Processor Materials

      42
  • 3.8 Processor Markings

    42
    • Figure 8. Processor Top-Side Markings Example (Intel® Pentium® D Processor 900 Sequence)

      42
    • Figure 9. Processor Top-Side Markings Example (Intel® Pentium® Processor Extreme Edition 955, 965)

      43
  • 3.9 Processor Land Coordinates

    43
    • Figure 10. Processor Land Coordinates and Quadrants (Top View)

      44
• 4 Land Listing and Signal Descriptions

  45
  • 4.1 Processor Land Assignments

    45
    • Figure 11. land-out Diagram (Top View - Left Side)

      46
    • Figure 12. land-out Diagram (Top View - Right Side)

      47
    • Table 23. Alphabetical Land Assignments

      48
    • Table 24. Numerical Land Assignment

      59
  • 4.2 Alphabetical Signals Reference

    70
    • Table 25. Signal Description (Sheet 1 of 9)

      70
• 5 Thermal Specifications and Design Considerations

  81
  • 5.1 Processor Thermal Specifications

    81
    • 5.1.1 Thermal Specifications

      81
      • Table 26. Processor Thermal Specifications

        82
      • Table 27. Thermal Profile for 775_VR_CONFIG_05B Processors (Performance)

        83
      • Figure 13. Thermal Profile for 775_VR_CONFIG_05B Processors (Performance)

        83
      • Table 28. Thermal Profile for 775_VR_CONFIG_05A Processors (Mainstream)

        84
      • Figure 14. Thermal Profile for 775_VR_CONFIG_05A Processors (Mainstream)

        84
    • 5.1.2 Thermal Metrology

      85
      • Figure 15. Case Temperature (TC) Measurement Location

        85
  • 5.2 Processor Thermal Features

    85
    • 5.2.1 Thermal Monitor

      85
    • 5.2.2 On-Demand Mode

      86
    • 5.2.3 PROCHOT# Signal

      86
    • 5.2.4 FORCEPR# Signal

      87
    • 5.2.5 THERMTRIP# Signal

      88
    • 5.2.6 TCONTROL and Fan Speed Reduction

      88
    • 5.2.7 Thermal Diode

      88
      • Table 29. Thermal “Diode” Parameters using Diode Model

        88
      • Table 30. Thermal “Diode” Parameters using Transistor Model

        89
      • Table 31. Thermal “Diode” ntrim and Diode_Correction_Offset

        90
      • Table 32. Thermal Diode Interface

        90
• 6 Features

  91
  • 6.1 Power-On Configuration Options

    91
    • Table 33. Power-On Configuration Option Signals

      91
  • 6.2 Clock Control and Low Power States

    91
    • Figure 16. Processor Low Power State Machine

      92
    • 6.2.1 Normal State

      92
    • 6.2.2 HALT and Enhanced HALT Powerdown States

      92
      • 6.2.2.1 HALT Powerdown State

        92
      • 6.2.2.2 Enhanced HALT Powerdown State

        93
    • 6.2.3 Stop Grant State

      93
    • 6.2.4 Enhanced HALT Snoop or HALT Snoop State, Stop Grant Snoop State

      94
      • 6.2.4.1 HALT Snoop State, Stop Grant Snoop State

        94
      • 6.2.4.2 Enhanced HALT Snoop State

        94
    • 6.2.5 Enhanced Intel® SpeedStep® Technology

      94
• 7 Boxed Processor Specifications

  95
  • Figure 17. Mechanical Representation of the Boxed Processor

    95
  • 7.1 Mechanical Specifications

    95
    • 7.1.1 Boxed Processor Cooling Solution Dimensions

      95
      • Figure 18. Space Requirements for the Boxed Processor (Side View: applies to all four side views)

        96
      • Figure 19. Space Requirements for the Boxed Processor (Top View)

        96
      • Figure 20. Space Requirements for the Boxed Processor (Overall View)

        97
    • 7.1.2 Boxed Processor Fan Heatsink Weight

      97
    • 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly

      97
  • 7.2 Electrical Requirements

    97
    • 7.2.1 Fan Heatsink Power Supply

      97
      • Figure 21. Boxed Processor Fan Heatsink Power Cable Connector Description

        98
      • Table 34. Fan Heatsink Power and Signal Specifications

        98
      • Figure 22. Baseboard Power Header Placement Relative to Processor Socket

        99
  • 7.3 Thermal Specifications

    99
    • 7.3.1 Boxed Processor Cooling Requirements

      99
      • Figure 23. Boxed Processor Fan Heatsink Airspace Keep-out Requirements (Side 1 View)

        100
      • Figure 24. Boxed Processor Fan Heatsink Airspace Keep-out Requirements (Side 2 View)

        100
• 8 Balanced Technology Extended (BTX) Boxed Processor Specifications

  101
  • Figure 25. Mechanical Representation of the Boxed Processor with a Type I TMA

    101
  • Figure 26. Mechanical Representation of the Boxed Processor with a Type II TMA

    102
  • 8.1 Mechanical Specifications

    102
    • 8.1.1 Balanced Technology Extended (BTX) Type I and Type II Boxed Processor Cooling Solution Dimensions

      102
      • Figure 27. Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes

        103
      • Figure 28. Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume

        104
    • 8.1.2 Boxed Processor Thermal Module Assembly Weight

      104
    • 8.1.3 Boxed Processor Support and Retention Module (SRM)

      104
      • Figure 29. Assembly Stack Including the Support and Retention Module

        105
  • 8.2 Electrical Requirements

    105
    • 8.2.1 Thermal Module Assembly Power Supply

      105
      • Figure 30. Boxed Processor TMA Power Cable Connector Description

        106
      • Table 35. TMA Power and Signal Specifications

        106
      • Figure 31. Balanced Technology Extended (BTX) Mainboard Power Header Placement (Hatched Area)

        107
  • 8.3 Thermal Specifications

    107
    • 8.3.1 Boxed Processor Cooling Requirements

      107
    • 8.3.2 Variable Speed Fan

      108
      • Figure 32. Boxed Processor TMA Set Points

        108
      • Table 36. TMA Set Points for 3-wire operation of BTX Type I and Type II Boxed Processors

        109
• 9 Debug Tools Specifications

  111
  • 9.1 Logic Analyzer Interface (LAI)

    111
    • 9.1.1 Mechanical Considerations

      111
    • 9.1.2 Electrical Considerations

      111