用户手册目录EU Declaration of Conformity3Table of Contents5Preface7Introduction7Document Layout7Conventions Used in this Guide8Warranty Registration9Recommended Reading9The Microchip Web Site10Development Systems Customer Change Notification Service10Customer Support11Revision History11Chapter 1. Overview131.1 Introduction131.2 Hillstar Concept and Deliverables131.3 Hillstar Development Kit Package Content14Figure 1-1: Hillstar Development Kit141.4 Hillstar Development Kit Reference Electrodes15Figure 1-2: Hillstar Development Kit Reference Electrodes15Table 1-1: Electrode Dimensions16Figure 1-3: Electrode Dimensions171.5 MGC3130 Software Package – Aurea GUI and GestIC Library171.6 MGC3130 Software Development Kit (SDK)17Chapter 2. Getting Started192.1 Prerequisites19Figure 2-1: Folder Structure192.2 Step 1: Build-up Development Kit19Figure 2-2: Hillstar development Kit Assembling202.3 Step 2: Connecting Hillstar Development Kit with Your PC202.4 Step 3: Install Windows CDC Driver202.5 Step 4: Start Aurea20Figure 2-3: Aurea Graphical User Interface21Chapter 3. Hillstar Boards – Hardware Description233.1 Overview23Figure 3-1: Hillstar Development Kit Overview233.1.1 I2C™ to USB Bridge233.1.2 MGC3130 Unit233.1.3 95x60 mm Reference Electrode PCB233.2 MGC3130 Unit24Figure 3-2: MGC3130 Unit24Table 3-1: MGC3130 Unit I2C™ interface Selection243.3 Hillstar 95x60 mm Reference Electrode25Figure 3-3: Hillstar PCB Electrode25Figure 3-4: Electrode Layout26Table 3-2: Hillstar Electrode Dimensions26Figure 3-5: PCB Layer Stack273.4 I2C to USB Bridge27Figure 3-6: I2C™ to USB Bridge27Figure 3-7: I2C™ and USB Data Interface28Chapter 4. Design In: Hillstar In Target Application294.1 Introduction294.2 Integration Examples29Figure 4-1: MGC3130 Parameterization Circuit with Internal Switch30Figure 4-2: MGC3130 Parameterization Circuit with External Switch30Figure 4-3: MGC3130 Parameterization Circuit for USB Based Applications31Table 4-1: MGC3130 Parameterization Circuits Comparison31Chapter 5. Troubleshooting33Appendix A. Schematics35A.1 Introduction35A.2 Bill of Materials35Table A-1: I2C™ to USB Bridge Bill of Materials35Table A-2: Hillstar – I2C™ to USB Bridge Mounting Option35Table A-3: Hillstar – MGC3130 Unit bill of Materials36Table A-4: Hillstar – MGC3130 Unit Mounting Option36A-5: Hillstar – Electrode Bill of Materials36A.3 Board – Schematics and Layout37Figure A-1: HilLstar GestIC® Unit Schematic37Figure A-2: Assembly of MGC3130 Unit38Figure A-3: Hillstar I2C™ to USB Bridge Schematic38Figure A-4: Assembly of Hillstar I2C™ to USB Bridge39Appendix B. Sensitivity Profile and Capacitances41B.1 Introduction41B.2 Sensitivity Profiles41Figure B-1: Sensitivity Profile from West to East41Figure B-2: Sensitivity Profile from North to South42B.3 Electrode Capacities42Table B-3: Hillstar Electrode Capacities42Appendix C. Parameterization Support43C.1 How to Build a Hand Brick43C.2 Usage of the Hand Brick as Artificial Hand45Figure C-1: Usage of Artificial Hand46Appendix D. Driver Installation Manual47D.1 Open Device Manager47Figure D-1: Computer Management47D.2 Select Device47Figure D-2: Update Driver Software48D.3 Locate Driver48Figure D-3: Browse for Driver Software48D.4 Verify Communication48Appendix E. Glossary49Table E-1: GestIC® Glossary49Trademarks2Worldwide Sales and Service50文件大小： 2.8 MB页数： 50Language: English打开用户手册
数据表目录Introduction:1Applications:1Power Features:1Key Features:1Peripheral Features:1Package Type2Table of Contents4Most Current Data Sheet4Errata4Customer Notification System41.0 Theory of Operation: Electrical Near-Field (E-Field) Sensing5FIGURE 1-1: Equipotential Lines of an Undistorted E-Field5FIGURE 1-2: Equipotential Lines of a Distorted E-Field51.1 GestIC Technology Benefits62.0 Feature Description72.1 Gesture Definition72.2 GestIC Library72.2.1 Colibri Suite7FIGURE 2-1: Colibri Suite Core Elements7FIGURE 2-2: Sensor Touch Diagram8FIGURE 2-3: Approach Detection Sequence93.0 System Architecture103.1 MGC3130 Controller103.2 GestIC Library103.3 External Electrodes10FIGURE 3-1: MGC3130 Controller System Architecture103.3.1 Electrode Equivalent Circuit11FIGURE 3-2: Electrodes Capacitive Equivalent Circuitry Earth Grounded11EQUATION 3-1: Electrodes Equivalent Circuit11TABLE 3-1: Electrodes Capacitances Typical Values113.3.2 Standard Electrode Design12FIGURE 3-3: Frame Shape Electrodes124.0 Functional Description13FIGURE 4-1: MGC3130 Controller Block Diagram134.1 Reset Block14FIGURE 4-2: System Reset Block Diagram144.2 Power Control and Clocks144.2.1 Power Management Unit (PMU)14FIGURE 4-3: Power Scheme Block Diagram144.2.2 Power Supervisors15FIGURE 4-4: Step-up Applications Start-up15FIGURE 4-5: Power Supervisors164.2.3 Clocks174.2.4 Operation Modes17FIGURE 4-6: MGC3130 Power Profile18TABLE 4-1: Current Consumption Overview18EQUATION 4-1: processing Mode Current Consumption18FIGURE 4-7: Current Consumption for Varying Time Intervals Between Approach Scans and Calibration Scans19FIGURE 4-8: Current Consumption for a Fixed Time Interval Between Approach Scans of 20 ms19TABLE 4-2: Operation Modes Summary204.2.5 Power-up/down Sequence20FIGURE 4-9: Power-Up Sequence Timings20Power-up Phases21TABLE 4-3: Power-Up Time-out (tPWRT)21Signal References21FIGURE 4-10: Power-Down Sequence Timings21Power-down Phases22Signal References224.3 Transmit Signal Generation224.4 Receive (Rx) Channels22FIGURE 4-11: Signal Conditioning Block224.5 Analog-to-Digital Converter (ADC)224.6 Signal Processing Unit (SPU)224.7 Parameters Storage225.0 Application Architecture235.1 Single-Zone Design23FIGURE 5-1: Single-Zone Design235.2 Dual-Zone Design23FIGURE 5-2: Dual-Zone Design236.0 Interface Description246.1 Interface Selection24TABLE 6-1: MGC3130 Interface Selection Pins246.2 Extended Input Output (EIO)24TABLE 6-2: MGC3130 Extended IOS Functions246.3 Interrupt Requests246.4 Synchronization246.5 Gesture Port24FIGURE 6-1: Gesture Port Mapping25TABLE 6-3: Colibri Suite Events26FIGURE 6-2: Gesture Port Action27TABLE 6-4: GPIO Port Action Mapping276.6 Communication Interfaces286.6.1 I2C28TABLE 6-5: I2C™ Pin Description28TABLE 6-6: I2C™ Device ID Address28TABLE 6-7: I2C™ Device Write ID Address (0x84 or 0x86)28TABLE 6-8: I2C™ Device Read ID Address (0x85 or 0x87)286.6.2 Transfer Status Line29TABLE 6-9: Usage of Transfer Status Line30FIGURE 6-3: MGC3130 Communication Protocol306.6.3 SPI31TABLE 6-10: SPI Pin Description31TABLE 6-11: SPI CS Pin Description31FIGURE 6-4: I2C™ Master Read Bit Timing Diagram32FIGURE 6-5: I2C™ Master Write Bit Timing Diagram327.0 Hardware Integration337.1 ESD Considerations337.2 Power Noise Considerations337.3 Irradiated High-Frequency Noise337.4 Standard Schematic (3.3V £ Vdd £ 3.465V)33FIGURE 7-1: Standard Schematic for 3.3V £ Vdd £ 3.465V Voltage Range337.5 Bill of Materials (3.3V £ Vdd £ 3.465V)34TABLE 7-1: Bill of Materials for 3.3V £ Vdd £ 3.465V347.6 Standard Schematic Step-Up Setup (2.5V £ Vdd £ 3.465V)34FIGURE 7-2: Schematic Step-Up Setup for 2.5V £ Vdd £ 3.465V Voltage Range347.7 Bill of Materials (2.5V £ Vdd £ 3.465V)35TABLE 7-2: Bill of Materials for 2.5V £ Vdd £ 3.465V357.8 Layout Recommendation358.0 Development Support368.1 MGC3130 Software Package – Aurea GUI and GestIC Library368.2 MGC3130 Software Development Kit (SDK)368.3 MGC3130 PIC18F14K50 Host Reference Code368.4 MGC3130 Hillstar Hardware References368.5 Evaluation and Demonstration Kits368.6 GestIC Library Update369.0 Electrical Specifications379.1 Absolute Maximum Ratings(†)3710.0 Packaging Information3810.1 Package Marking Information3810.2 Package Details39Appendix A: Data Sheet Revision History42The Microchip Web Site43Customer Change Notification Service43Customer Support43Product Identification System44Trademarks45Worldwide Sales46文件大小： 1.2 MB页数： 46Language: English打开用户手册
