用户手册目录1. General description12. Features13. Applications14. Quick reference data25. Ordering information26. Block diagram37. Pinning information47.1 Pinning47.2 Pin description58. Functional description58.1 General58.2 Pulse width modulation frequency88.3 Protections88.3.1 Thermal protection88.3.1.1 Thermal FoldBack (TFB)88.3.1.2 OverTemperature Protection (OTP)98.3.2 OverCurrent Protection (OCP)98.3.3 Window Protection (WP)108.3.4 Supply voltage protections108.4 Differential audio inputs119. Limiting values1210. Thermal characteristics1211. Static characteristics1312. Dynamic characteristics1412.1 Switching characteristics1412.2 Stereo and dual SE application characteristics1512.3 Mono BTL application characteristics1613. Application information1713.1 Mono BTL application1713.2 Pin MODE1713.3 Output power estimation1713.3.1 SE1713.3.2 Bridge-Tied Load (BTL)1813.4 External clock1813.5 Noise1913.6 Heatsink requirements1913.7 Output current limiting2013.8 Pumping effects2113.9 Application schematics2113.10 Layout and grounding2313.11 Curves measured in reference design2414. Package outline3315. Soldering of SMD packages3515.1 Introduction to soldering3515.2 Wave and reflow soldering3515.3 Wave soldering3515.4 Reflow soldering3616. Revision history3717. Legal information3817.1 Data sheet status3817.2 Definitions3817.3 Disclaimers3817.4 Trademarks3818. Contact information3819. Contents39文件大小： 276.8 KB页数： 39Language: English打开用户手册
用户手册目录1. General description12. Features13. Applications14. Quick reference data25. Ordering information26. Block diagram37. Pinning information47.1 Pinning47.2 Pin description58. Functional description58.1 General58.2 Pulse width modulation frequency88.3 Protections88.3.1 Thermal protection88.3.1.1 Thermal FoldBack (TFB)88.3.1.2 OverTemperature Protection (OTP)98.3.2 OverCurrent Protection (OCP)98.3.3 Window Protection (WP)108.3.4 Supply voltage protections108.4 Differential audio inputs119. Limiting values1210. Thermal characteristics1211. Static characteristics1312. Dynamic characteristics1412.1 Switching characteristics1412.2 Stereo and dual SE application characteristics1512.3 Mono BTL application characteristics1613. Application information1713.1 Mono BTL application1713.2 Pin MODE1713.3 Output power estimation1713.3.1 SE1713.3.2 Bridge-Tied Load (BTL)1813.4 External clock1813.5 Noise1913.6 Heatsink requirements1913.7 Output current limiting2013.8 Pumping effects2113.9 Application schematics2113.10 Layout and grounding2313.11 Curves measured in reference design2414. Package outline3315. Soldering of SMD packages3515.1 Introduction to soldering3515.2 Wave and reflow soldering3515.3 Wave soldering3515.4 Reflow soldering3616. Revision history3717. Legal information3817.1 Data sheet status3817.2 Definitions3817.3 Disclaimers3817.4 Trademarks3818. Contact information3819. Contents39文件大小： 276.8 KB页数： 39Language: English打开用户手册
