Atmel ARM-Based Evaluation Kit AT91SAM9N12-EK AT91SAM9N12-EK Data Sheet

Product codes
AT91SAM9N12-EK
Page of 1104
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SAM9N12/SAM9CN11/SAM9CN12 [DATASHEET]
11063K–ATARM–05-Nov-13
Figure 31-21. Automatic Update During AUTO-REFRESH Command and SDRAM Access
31.5.4.2 Power-down Mode
This mode is activated by setting the low-power command bits (LPCB) to ‘2’ in 
.
Power-down mode is used when no access to the SDRAM device is possible. In this mode, power consumption is
greater than in self-refresh mode. This state is similar to normal mode (No low-power mode/No self-refresh mode), but
the CKE pin is low and the input and output buffers are deactivated as soon the SDRAM device is no longer accessible.
In contrast to self-refresh mode, the SDRAM device cannot remain in low-power mode longer than the refresh period (64
ms). As no auto-refresh operations are performed in this mode, the DDRSDRC carries out the refresh operation. In order
to exit low-power mode, a NOP command is required in the case of Low-power SDR-SDRAM and SDR-SDRAM devices.
In the case of Low-power DDR1-SDRAM devices, the controller generates a NOP command during a delay of at least
TXP. In addition, Low-power DDR1-SDRAM and DDR2-SDRAM must remain in power-down mode for a minimum period
of TCKE periods. 
The exit procedure is faster than in self-refresh mode. See 
. The DDRSDRC returns to power-
down mode as soon as the SDRAM device is not selected. It is possible to define when power-down mode is enabled by
setting the register LPR, timeout command bit.
0 = Power-down mode is enabled as soon as the SDRAM device is not selected
1 = Power-down mode is enabled 64 clock cycles after completion of the last access
2 = Power-down mode is enabled 128 clock cycles after completion of the last access
NOP
NOP
PRCHALL
MRS
ARFSH
NOP
0
Trfc
SDCLK
A[12:0]
COMMAND
CKE
BA[1:0]
2
NOP
Update Extended mode 
register 
Trp
Pasr-Tcr-Ds
ACT
0
Tmrd