Nxp Semiconductors LPC2917 User Manual

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LPC2917_19_1
© NXP B.V. 2007. All rights reserved.
Preliminary data sheet
Rev. 1.01 — 15 November 2007 
55 of 68
NXP Semiconductors
LPC2917/19
ARM9 microcontroller with CAN and LIN
[1]
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
amb
= 125 
°C on wafer 
level. Cased products are tested at T
amb
= 25 
°C (final testing). Both pre-testing and final testing use correlated test conditions to cover 
the specified temperature and power-supply voltage range.
[2]
Leakage current is exponential to temperature; worst-case value is at 125 C Tvj. All clocks off. Analog modules and FLASH powered 
down.
[3]
For Port 0, pin 0 to pin 15 add maximum 1.5 pF for input capacitance to ADC. For Port 0, pin 16 to pin 31 add maximum 1.0 pF for input 
capacitance to ADC.
[4]
This value is the minimum drive capability. Maximum short-circuit output current is 33 mA (drive HIGH-level, shorted to ground) or 
−38 mA. (drive LOW-level, shorted to V
DD(IO)
). The device will be damaged if multiple outputs are shorted.
[5]
C
xtal
 is crystal load capacitance and C
ext
 are the two external load capacitors.
[6]
The power-up reset has a time filter: V
DD(CORE)
 must be above V
trip(high)
 for 2 
μs before reset is de-asserted; V
DD(CORE)
 must be below 
V
trip(low)
 for 11
μs before internal reset is asserted.
[7]
Not 5 V-tolerant when pull-up is on.
[8]
For I/O Port 0, the maximum input voltage is defined by V
I(ADC)
.
[9]
This parameter is not part of production testing or final testing, hence only a typical value is stated. Maximum and minimum values are 
based on simulation results.
12. Dynamic characteristics
 
Oscillator
R
s(xtal)
Crystal series resistance.
f
osc
= 10 MHz to 15 MHz
C
xtal
= 10 pF; 
C
ext
= 18 pF
-
-
160
Ω
C
xtal
= 20 pF; 
C
ext
= 39 pF
-
-
60
Ω
f
osc
= 15 MHz to 20 MHz
C
xtal
= 10 pF; 
C
ext
= 18 pF
-
-
80
Ω
C
i
Input capacitance of 
XIN_OSC.
-
2
pF
Power-up reset
V
trip(high)
High trip-level voltage.
1.2
1.4
1.6
V
V
trip(low)
Low trip-level voltage.
1.1
1.3
1.5
V
V
trip(dif)
Difference between high 
and low trip-level 
voltages.
50
120
180
mV
Table 30.
Static characteristics
 …continued
V
DD(CORE)
= V
DD(OSC_PLL)
; V
DD(IO)
= 2.7 V to 3.6 V; V
DD(A3V3)
= 3.0 V to 3.6 V; T
vj
= -40
°
C to +125
°
C; all voltages are 
measured with respect to ground; positive currents flow into the IC; unless otherwise specified.
[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Table 31.
Dynamic characteristics
V
DD(CORE)
= V
DD(OSC_PLL)
; V
DD(IO)
= 2.7 V to 3.6 V; V
DD(A3V3)
= 3.0 V to 3.6 V; T
vj
=
40 
°
C; all voltages are measured with 
respect to ground; positive currents flow into the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
I/O pins
t
THL
HIGH-to-LOW 
transition time.
C
L
= 30 pF
4
-
13.8
ns
t
TLH
LOW-to-HIGH 
transition time.
C
L
= 30 pF
4
-
13.8
ns