Nxp Semiconductors LPC2917 User Manual
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LPC2917_19_1
© NXP B.V. 2007. All rights reserved.
Preliminary data sheet
Rev. 1.01 — 15 November 2007
55 of 68
NXP Semiconductors
LPC2917/19
ARM9 microcontroller with CAN and LIN
[1]
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
amb
= 125
°C on wafer
level. Cased products are tested at T
amb
= 25
°C (final testing). Both pre-testing and final testing use correlated test conditions to cover
the specified temperature and power-supply voltage range.
[2]
Leakage current is exponential to temperature; worst-case value is at 125 C Tvj. All clocks off. Analog modules and FLASH powered
down.
down.
[3]
For Port 0, pin 0 to pin 15 add maximum 1.5 pF for input capacitance to ADC. For Port 0, pin 16 to pin 31 add maximum 1.0 pF for input
capacitance to ADC.
capacitance to ADC.
[4]
This value is the minimum drive capability. Maximum short-circuit output current is 33 mA (drive HIGH-level, shorted to ground) or
−38 mA. (drive LOW-level, shorted to V
−38 mA. (drive LOW-level, shorted to V
DD(IO)
). The device will be damaged if multiple outputs are shorted.
[5]
C
xtal
is crystal load capacitance and C
ext
are the two external load capacitors.
[6]
The power-up reset has a time filter: V
DD(CORE)
must be above V
trip(high)
for 2
μs before reset is de-asserted; V
DD(CORE)
must be below
V
trip(low)
for 11
μs before internal reset is asserted.
[7]
Not 5 V-tolerant when pull-up is on.
[8]
For I/O Port 0, the maximum input voltage is defined by V
I(ADC)
.
[9]
This parameter is not part of production testing or final testing, hence only a typical value is stated. Maximum and minimum values are
based on simulation results.
based on simulation results.
12. Dynamic characteristics
Oscillator
R
s(xtal)
Crystal series resistance.
f
osc
= 10 MHz to 15 MHz
C
xtal
= 10 pF;
C
ext
= 18 pF
-
-
160
Ω
C
xtal
= 20 pF;
C
ext
= 39 pF
-
-
60
Ω
f
osc
= 15 MHz to 20 MHz
C
xtal
= 10 pF;
C
ext
= 18 pF
-
-
80
Ω
C
i
Input capacitance of
XIN_OSC.
XIN_OSC.
-
2
pF
Power-up reset
V
trip(high)
High trip-level voltage.
1.2
1.4
1.6
V
V
trip(low)
Low trip-level voltage.
1.1
1.3
1.5
V
V
trip(dif)
Difference between high
and low trip-level
voltages.
and low trip-level
voltages.
50
120
180
mV
Table 30.
Static characteristics
…continued
V
DD(CORE)
= V
DD(OSC_PLL)
; V
DD(IO)
= 2.7 V to 3.6 V; V
DD(A3V3)
= 3.0 V to 3.6 V; T
vj
= -40
°
C to +125
°
C; all voltages are
measured with respect to ground; positive currents flow into the IC; unless otherwise specified.
[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Table 31.
Dynamic characteristics
V
DD(CORE)
= V
DD(OSC_PLL)
; V
DD(IO)
= 2.7 V to 3.6 V; V
DD(A3V3)
= 3.0 V to 3.6 V; T
vj
=
−
40
°
C; all voltages are measured with
respect to ground; positive currents flow into the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
I/O pins
t
THL
HIGH-to-LOW
transition time.
transition time.
C
L
= 30 pF
4
-
13.8
ns
t
TLH
LOW-to-HIGH
transition time.
transition time.
C
L
= 30 pF
4
-
13.8
ns