AMD 1207 Manuale Utente
14
Processor Thermal Solutions
Chapter 2
32800
Rev. 3.02
August 2006
Thermal Design Guide for Socket F (1207) Processors
2.2
Socket Description
Figure 1 shows a three-dimensional view of the 1207-pin socket used with socket F (1207)
processors. This socket is based on LGA (land-grid array) technology. The LGA socket has 35 pads x
35 pads on a 1.1 mm pitch, with a 3.52 mm wide de-populated BGA (ball grid array) zone in the
center, plus a 0.66 mm offset between the two BGA arrays. A small solder-ball makes the electrical
and mechanical connection to the motherboard at each socket contact.
processors. This socket is based on LGA (land-grid array) technology. The LGA socket has 35 pads x
35 pads on a 1.1 mm pitch, with a 3.52 mm wide de-populated BGA (ball grid array) zone in the
center, plus a 0.66 mm offset between the two BGA arrays. A small solder-ball makes the electrical
and mechanical connection to the motherboard at each socket contact.
Figure 1.
The 1207-Pin Socket