AMD 1207 Manuale Utente
16
Thermal Design of Platforms Using the AMD Processor-In-a-
Box (PIB) Thermal Solution
Chapter 3
32800
Rev. 3.02
August 2006
Thermal Design Guide for Socket F (1207) Processors
Depending on the system features and layout, more space around the socket may be available for the
thermal solution than is shown in Figure 2 on page 15. This space permits heat sink designs with
better thermal performance.
thermal solution than is shown in Figure 2 on page 15. This space permits heat sink designs with
better thermal performance.
Appendix A on page 37 shows a complete, detailed set of keep-out drawings for the AMD PIB
thermal solution for socket F (1207).
thermal solution for socket F (1207).
3.2
Thermal Solution Design Requirements
Table 2 provides the design-target specifications that must be met for the processor to operate reliably
in a typical platform using the AMD PIB thermal solution for socket F (1207) processors.
in a typical platform using the AMD PIB thermal solution for socket F (1207) processors.
3.3
Sample Heat Sinks and Attachment Methods
The heat sink, fan, mounting spring clip, and thermal interface material used for the AMD PIB
thermal solution for socket F (1207) processors are the same as the heat sink, fan, mounting spring
clip, and thermal interface material used for systems based on the socket 940 processor.
thermal solution for socket F (1207) processors are the same as the heat sink, fan, mounting spring
clip, and thermal interface material used for systems based on the socket 940 processor.
The backplate and retention frame are different from those used in the socket 940 processor. The
EMC shield implemented in the socket 940-based systems is not recommended for AMD PIB thermal
solutions for socket F (1207) processors.
EMC shield implemented in the socket 940-based systems is not recommended for AMD PIB thermal
solutions for socket F (1207) processors.
Table 2.
Thermal Solution Design Requirements for Platforms Using Socket F (1207) PIB
processors
processors
Symbol
Description
Maximum
L
Length of heat sink
68 mm
W
Width of heat sink
77 mm
H
Height of heat sink
60 mm
θ
ca
Case-to-ambient thermal
resistance
0.26°C/W
1
M
HS
Mass of heat sink
450 g to 700 g
2
F
clip
Clip force
75 lbs ±15 lbs
T
A
Local ambient temperature near
processor
38°C
Notes:
1. This is the thermal resistance required for dual-core, 90-nm socket F (1207) processors. The thermal resistance
requirement may vary depending on the product OPN. The user should consult the processor data sheet for the
thermal requirements specific to the part.
thermal requirements specific to the part.
2. Heat sinks weighing up to 450 g can be attached to the motherboard. Heat sinks weighing over 450 g should be tied
directly to the chassis for reliable shock and vibration performance.