AMD 1207 Manuale Utente
Chapter 3
Thermal Design of Platforms Using the AMD Processor-In-a-
Box (PIB) Thermal Solution
17
Thermal Design Guide for Socket F (1207) Processors
32800
Rev. 3.00
August 2006
Table 3 lists the parts used in the thermal reference design for the AMD PIB thermal solution for
socket F (1207) processors.
socket F (1207) processors.
Figure 3 on page 18 shows an exploded view of the thermal solution for platforms using an AMD PIB
based on socket F (1207) processors.
based on socket F (1207) processors.
Table 3.
Components for the Processor Thermal Reference Design for the AMD PIB
Thermal Solution
Thermal Solution
Part Description
Material
Quantity
Heat sink
Copper with aluminum fins
1
Heatpipe
Sintered-powder copper
2
Fan
Plastic
1
Spring clip
SK7 heat treated spring steel
1
Retention frame
Lexan, 20% glass-filled
2
Backplate
Low-carbon steel, anti-corrosive
finish
finish
1
Insulator
Formex GK-17
1