AMD 1207 Manuale Utente
Chapter 5
Thermal Design of Custom 2U-4P Systems
33
Thermal Design Guide for Socket F (1207) Processors
32800
Rev. 3.02
August 2006
5.3.2
Spring Clip
The spring clip is designed to apply 75 lbs of force to the center of the heat sink. This force is
necessary to help prevent the heat sink from lifting off of the package during shock or vibration-
induced events. Lifting the heat sink away from the processor can result in damage to the processor
contact pads, the socket contacts, or the socket solder-ball joints. Maintaining the spring force is
important for the life of the processor and for repeated installations and upgrades of the processor.
necessary to help prevent the heat sink from lifting off of the package during shock or vibration-
induced events. Lifting the heat sink away from the processor can result in damage to the processor
contact pads, the socket contacts, or the socket solder-ball joints. Maintaining the spring force is
important for the life of the processor and for repeated installations and upgrades of the processor.
The spring clip material is heat-treatable spring steel, SK7. AMD strongly recommends using SK7 or
an equivalent material for the spring clip. The clip should be plated after heat treatment for cosmetic
and anti-corrosive reasons. Table 9 gives the chemical composition of SK7. The heat treatment used
should bring the ultimate strength of the material to a minimum of 1,300 megapascals (MPa) or 189
kilopounds per square inch (kpsi), and it should bring the yield strength to 940 MPa (or 136 kpsi).
Other materials commonly used for heat sink spring clips have been shown to yield under the high
load of the initial spring-clip deflection and become deformed so that the spring clip can no longer
apply the same load.
an equivalent material for the spring clip. The clip should be plated after heat treatment for cosmetic
and anti-corrosive reasons. Table 9 gives the chemical composition of SK7. The heat treatment used
should bring the ultimate strength of the material to a minimum of 1,300 megapascals (MPa) or 189
kilopounds per square inch (kpsi), and it should bring the yield strength to 940 MPa (or 136 kpsi).
Other materials commonly used for heat sink spring clips have been shown to yield under the high
load of the initial spring-clip deflection and become deformed so that the spring clip can no longer
apply the same load.
5.3.3
Retention Frame
The plastic retention frame, made of 20% glass-filled Lexan, is a two-piece implementation rather
than the single-piece frame used for socket 940. This change accommodates the larger foot-print of
socket F (1207) processors.
than the single-piece frame used for socket 940. This change accommodates the larger foot-print of
socket F (1207) processors.
The retention frame serves multiple purposes. The retention frame aligns the heat sink and provides a
stop for the heat sink in large shock-force events. The retention frame and backplate are attached to
the motherboard by the motherboard vendor. Two screws securely hold the backplate and retention
frame together. The two mounting tabs on the retention frame serve as attachment points for the heat
sink spring clip.
stop for the heat sink in large shock-force events. The retention frame and backplate are attached to
the motherboard by the motherboard vendor. Two screws securely hold the backplate and retention
frame together. The two mounting tabs on the retention frame serve as attachment points for the heat
sink spring clip.
5.3.4
Heat Sink
Figure 10 on page 34 shows a picture of the reference design heat sink for 2U-4P systems. The
footprint of the reference design heat sink is 92 mm x 58 mm. The heat sink weighs 378 g and has an
aluminum fin stack soldered to the copper base. The copper base tapers from a thickness of 7 mm at
footprint of the reference design heat sink is 92 mm x 58 mm. The heat sink weighs 378 g and has an
aluminum fin stack soldered to the copper base. The copper base tapers from a thickness of 7 mm at
Table 9.
Chemical Element of SK7 Spring Steel
Element
Percentage of the Element
C
0.60-0.70
Si
Maximum 0.35
Mn
0.80-0.90
P
Maximum 0.030
S
Maximum 0.030
Fe
Remaining balance