AMD 1207 Manuale Utente

32800

Rev. 3.00

August 2006

the center to 2.5 mm at the edges. The heat sink also has three heat pipes soldered to the base and 
connected to the top of the fin stack to improve fin efficiency. This design provides optimum heat 
spreading performance from the processor to the heat sink. The fin geometry has been designed to 
provide optimized thermal performance in combination with the fans, as described in Section 5.3.5, 
on page 35, in a typical 2U-4P system. 

 

Table 10 shows the parameters of the aluminum fins for the high-performance heat sink shown in 
Figure 10.

Other fan and heat sink combinations may yield adequate thermal performance. The system designer 
must ensure that the thermal solution provides required cooling for the processor for the given system 
layout and flow characteristics.

Because the processor-mounting surface extends above the surface of the cam box on the socket, the 
heat sink bottom can be flat. The heat sink must have a flat surface of at least 40 mm x 40 mm, 
centered over the processor.

Figure 11 shows the measured thermal performance vs. flow rate for this heat sink. This data 
represents the expected performance of this heat sink on a dual-core socket F (1207) processor. Based 

92 mm

32.5 mm

37 mm

0.2 mm

1.5 mm

39