Proma 141030 PCB Bubble Etching Machine with Heater 141030 データシート

製品コード
141030
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gie
      - tec
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Gie-Tec GmbH    An der Schlierbach 18    D-36132 Eiterfeld    Tel.: +49 (0)6672/919-910    E-Mail:info@gie-tec.de
www
.gie-tec.de
The etching device will be delivered mounted completely. Only the glass 
heater and the thermometer has to plug in into the holes at the top of the tank.
Place the etching device into the catch basin. Place the device on a horizontal, 
stable and acid-proof basis (e. g. tiled table).
               
          The working area should be ventilatable and well illuminated!
1. Start-up
1.1 Placement
ACHTUNG!
GEFAHR!
Technische Änderungen vorbehalten
1.2 Assembly
1. Place the etching device into the catch 
basin (1). Place the device on a 
horizontal, stable and acid-proof basis.
2. Plug in the glass heater(2) into the hole, 
top of the tank
3.  Fill water into the tank (4) (see technical 
data). Please note: The water level 
should about 2-3 cm below the maximum 
high of the cuvette.
4.  Connect the membrane pump (5) to 
power supply (AC 230V /50-60Hz). 
Please check, if small air bubbles are 
comming out of the air cusion tube (3), 
which is laying inside the glass acrylic 
tank.
5. Thermometer (6)
6. Board holder (7)
7. Safety valve (8)
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1.3 Handling of the board holder
 
You can adjust the board holder by 
loosening the  screws (8) below the handle 
strip. 
In case of one-sided boards, you can double 
the holding capacity by clambing the boards 
back-to-back.
If you do not tighten the screws, you can also shift the strips without 
having to operate the screws. 
For larger boards, remove the middle strip.
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1.4 Etching bath
For etching, we recommend only our sodium persulfate. This etching mediums 
is odorless, clear, and pollutes the device only insignificantly.
Further sodium persulfate has the positive feature to get blue if solution is 
saturated. 
It achives etching times of 6-8 minutes at 40-45°C. The etching speed lies 
between 4 and 7 µm/min with a copper reception of approx.: 30g/l. The batch 
amount ist 200 - 250 g/l of water.
- Unplug all mains plugs before filling in the etching sulfate.
- Fill water into the tanks (see technical data) and then pour the etching 
  sulfate into the water. 
- Place the borad holder into the tank as a cover
- Connect the membrane pump and the glass heater to mains again.
In case of using other etching chemicals, we can not take over any 
guarantee for the function of the device since these chemicals may 
disolve the glue of the glass cuvette.
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E
tching device 1 and 2 can be used for 
etching printed circuit boards and metal 
foils of various sizes.
Any other use of the device is not 
permitted.
The device is designed for power 
supply AC 230V (50- 60Hz) and may 
used only in perfect technical 
condition.
Using the etching device it is not 
allowed by children and people which 
are not instructed.
The basis of the etching device (table, 
work bench) is supposed to be 
horizontally, stable, resistant to 
chemicals and easy to clean.
The area in which the devices are used 
should be well illuminated and 
ventilatable.
Not required tools, devices or 
components are to be kept away from 
the working area.
Eating, drinking and smoking are 
strictly prohibited!
Keep devices and chemicals out of 
the range of children and foods.
Store not required chemicals in the 
original container in a dry place.
Assembly and using of the device has 
to be done only according the 
declaration of conformity.
Carry corresponding protective clothing 
(acid and alkal-proof protection gloves, 
protective  goggles,  overall  or  apron) 
when applying the bath or when working 
with the device. 
The  device  must  not  exposed  to  high 
humidity, strong vibrations or explosive 
gas.
Keep this manual careful. Personal 
working with this equipment are to be 
instructed about the dangers.
If you don´t provide this manual, loss 
of property, risk of injury may can 
happen.
Pay attention to the disposal remaks for 
waste materials.
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