Acer Intel Celeron G530 KC.53001.CDG Benutzerhandbuch

90

 Datasheet

The Celeron processor on 0.13 micron process incorporates an on-die thermal diode. A thermal 
sensor located on the system board may monitor the die temperature of the processor for thermal 
management/long term die temperature change purposes. 

 provide the diode 

parameter and interface specifications. This thermal diode is separate from the Thermal Monitor’s 
thermal sensor and cannot be used to predict the behavior of the Thermal Monitor.

1.

Intel does not support or recommend operation of the thermal diode under reverse bias.

I

FW

Forward Bias Current

5

300

µ

A

n

Diode Ideality Factor

1.0011

1.0021

1.0030

2,

 

3,

 

4

2.

Characterized at 75 

°

C.

3.

Not 100% tested. Specified by design characterization.

4.

The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode equa-
tion:I

FW

=I

s

*(e

(qV

D

/nkT

-1)

Where I

S

 = saturation current, q = electronic charge, V

D 

= voltage across the diode, k = Boltzmann Constant,

and T = absolute temperature (Kelvin). 

R

T

Series Resistance

3.64

,

 

 

5

5.

The series resistance, R

T

, is provided to allow for a more accurate measurement of the diode junction tem-

perature. R

T

 as defined includes the pins of the processor but does not include any socket resistance or

board trace resistance between the socket and the external remote diode thermal sensor. R

T

 can be used

by remote diode thermal sensors with automatic series resistance cancellation to calibrate out this error term.
Another application is that a temperature offset can be manually calculated and programmed into an offset
register in the remote diode thermal sensors as exemplified by the equation:
T

error

 = [R

T

*(N-1)*I

FWmin

]/[(nk/q)*ln N]

Where T

error

 = sensor temperature error, N = sensor current ration, k = Boltzmann Constant, q = electronic

charge. 

THERMDA

B3

Diode anode

THERMDC

C4

Diode cathode