Acer Intel Celeron G530 KC.53001.CDG Benutzerhandbuch

Produktcode
KC.53001.CDG
Seite von 102
92
 
Intel
®
 Celeron
®
 Processor on 0.13 Micron Process in the 478-Pin Package
 Datasheet
Boxed Processor Specifications
8.2
Mechanical Specifications
8.2.1
Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed Celeron processor on 
0.13 micron process. The boxed processor will be shipped with an unattached fan heatsink. 
 shows a mechanical representation of the boxed Celeron
 
processor on 0.13 micron 
process.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The 
physical space requirements and dimensions for the boxed processor with assembled fan heatsink 
are shown in 
 (Side Views), and 
 (Top View). The airspace requirements for the 
boxed processor fan heatsink must also be incorporated into new motherboard and system designs. 
Airspace requirements are shown in 
 an
. Note that some figures have center 
lines shown (marked with alphabetic designations) to clarify relative dimensioning. 
Figure 39. Side View Space Requirements for the Boxed Processor