Acer Intel Celeron G530 KC.53001.CDG Benutzerhandbuch
Produktcode
KC.53001.CDG
Intel
®
Celeron
®
Processor on 0.13 Micron Process in the 478-Pin Package Datasheet
93
Boxed Processor Specifications
8.2.2
Boxed Processor Fan Heatsink Weight
The boxed processor fan heatsink will not weigh more than 450 grams. See the Intel
£
Pentium
£
4
Processor in the 478-pin Package Thermal Design Guidelines for details on the processor weight
and heatsink requirements.
and heatsink requirements.
8.2.3
Boxed Processor Retention Mechanism and Heatsink
Assembly
Assembly
The boxed processor thermal solution requires a processor retention mechanism and a heatsink
attach clip assembly to secure the processor and fan heatsink in the baseboard socket. The boxed
processor will not ship with retention mechanisms but will ship with the heatsink attach clip
assembly. Motherboards designed for use by system integrators should include the retention
mechanism that supports the boxed Celeron processor on 0.13 micron process. Motherboard
documentation should include appropriate retention mechanism installation instructions.
attach clip assembly to secure the processor and fan heatsink in the baseboard socket. The boxed
processor will not ship with retention mechanisms but will ship with the heatsink attach clip
assembly. Motherboards designed for use by system integrators should include the retention
mechanism that supports the boxed Celeron processor on 0.13 micron process. Motherboard
documentation should include appropriate retention mechanism installation instructions.
Note:
The processor retention mechanism based on the Intel reference design should be used to ensure
compatibility with the heatsink attach clip assembly and the boxed processor thermal solution. The
compatibility with the heatsink attach clip assembly and the boxed processor thermal solution. The
Figure 40. Top View Space Requirements for the Boxed Processor