Acer Intel Celeron G530 KC.53001.CDG Benutzerhandbuch
Produktcode
KC.53001.CDG
94
Intel
®
Celeron
®
Processor on 0.13 Micron Process in the 478-Pin Package
Datasheet
Boxed Processor Specifications
heatsink attach clip assembly is latched to the retention tab features at each corner of the retention
mechanism.
mechanism.
The target load applied by the clips to the processor heat spreader for Intel’s reference design is
75 ±15 lbf (maximum load is constrained by the package load capability). It is normal to observe a
bow or bend in the board due to this compressive load on the processor package and the socket.
The level of bow or bend depends on the motherboard material properties and component layout.
Any additional board stiffening devices (like plates) are not necessary and should not be used along
with the reference mechanical components and boxed processor. Using such devices increases the
compressive load on the processor package and socket, likely beyond the maximum load that is
specified for those components. See the Pentium
75 ±15 lbf (maximum load is constrained by the package load capability). It is normal to observe a
bow or bend in the board due to this compressive load on the processor package and the socket.
The level of bow or bend depends on the motherboard material properties and component layout.
Any additional board stiffening devices (like plates) are not necessary and should not be used along
with the reference mechanical components and boxed processor. Using such devices increases the
compressive load on the processor package and socket, likely beyond the maximum load that is
specified for those components. See the Pentium
£
4 Processor in the 478-pin Package in the
478-pin Package Thermal Design Guidelines for details on the Intel reference design.
Chassis that have adequate clearance between the motherboard and chassis wall (minimum
0.250 inch) should be selected to ensure that the board's underside bend does not contact the
chassis.
0.250 inch) should be selected to ensure that the board's underside bend does not contact the
chassis.
8.3
Electrical Requirements
8.3.1
Fan Heatsink Power Supply
The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable will be
shipped with the boxed processor to draw power from a power header on the motherboard. The
power cable connector and pinout are shown in
shipped with the boxed processor to draw power from a power header on the motherboard. The
power cable connector and pinout are shown in
. Motherboards must provide a matched
power header to support the boxed processor.
contains specifications for the input and
output signals at the fan heatsink connector. The fan heatsink outputs a SENSE signal, which is an
open-collector output that pulses at a rate of two pulses per fan revolution. A motherboard pull-up
resistor provides V
open-collector output that pulses at a rate of two pulses per fan revolution. A motherboard pull-up
resistor provides V
OH
to match the system board-mounted fan speed monitor requirements, if
applicable. Use of the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the
connector should be tied to GND.
connector should be tied to GND.
Note:
The motherboard must supply a constant +12 V to the processor’s power header to ensure proper
operation of the variable speed fan for the boxed processor.
operation of the variable speed fan for the boxed processor.
The power header on the baseboard must be positioned to allow the fan heatsink power cable to
reach it. The power header identification and location should be documented in the platform
documentation or on the system board itself.
reach it. The power header identification and location should be documented in the platform
documentation or on the system board itself.
shows the location of the fan power
connector relative to the processor socket. The motherboard power header should be positioned
within 4.33 inches from the center of the processor socket.
within 4.33 inches from the center of the processor socket.