Texas Instruments AM18x eXperimenter's Kit TMDSEXP1808L TMDSEXP1808L Datenbogen
Produktcode
TMDSEXP1808L
A1
A1
X
Y
OFFSET
Recommended DDR2/mDDR
Device Orientation
Y
Y
OFFSET
DDR2/mDDR
Device
DDR2/mDDR
Controller
SPRS653E – FEBRUARY 2010 – REVISED MARCH 2014
6.11.3.4 Placement
shows the required placement for the device as well as the DDR2/mDDR devices. The
dimensions for
are defined in
. The placement does not restrict the side of the PCB
that the devices are mounted on. The ultimate purpose of the placement is to limit the maximum trace
lengths and allow for proper routing space. For single-memory DDR2/mDDR systems, the second
DDR2/mDDR device is omitted from the placement.
lengths and allow for proper routing space. For single-memory DDR2/mDDR systems, the second
DDR2/mDDR device is omitted from the placement.
Figure 6-18. Device and DDR2/mDDR Device Placement
Table 6-24. Placement Specifications
(1) (2)
NO.
PARAMETER
MIN
MAX
UNIT
1
X
1750
Mils
2
Y
1280
Mils
3
Y Offset
(3)
650
Mils
4
Clearance from non-DDR2/mDDR signal to DDR2/mDDR Keepout Region
(4)
4
w
(5)
(1)
See
for dimension definitions.
(2)
Measurements from center of device to center of DDR2/mDDR device.
(3)
For single memory systems it is recommended that Y Offset be as small as possible.
(4)
Non-DDR2/mDDR signals allowed within DDR2/mDDR keepout region provided they are separated from DDR2/mDDR routing layers by
a ground plane.
a ground plane.
(5)
w = PCB trace width as defined in
.
114
Peripheral Information and Electrical Specifications
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