Embedded Artists GPS Receiver Board EA-ACC-023 EA-ACC-023 Datenbogen
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EA-ACC-023
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This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2011 GlobalTop Technology Inc. All Rights Reserved.
FGPMMOPA6H Data Sheet
GlobalTop Technology
Ver. V0A
Document #
5.3 Storage and Floor Life Guideline
Since GlobalTop modules must undergo solder-reflow process in 72 hours after it has gone through
pre-baking procedure, therefore if it is not used by then, it is recommended to store the GPS
modules in dry places such as dry cabinet.
The approximate shelf life for GlobalTop GPS modules packages is 6 months from the bag seal date,
when store in a non-condensing storage environment (<30°C/60% RH)
It is important to note that it is a required process for GlobalTop GPS modules to undergo
pre-baking procedures, regardless of the storage condition.
pre-baking procedures, regardless of the storage condition.
5.4 Drying
Because the vapor pressures of moisture inside the GPS modules increase greatly when it is exposed
to high temperature of solder reflow, in order to prevent internal delaminating, cracking of the
devices, or the “popcorn” phenomenon, it is a necessary requirement for GlobalTop GPS module to
undergo pre-baking procedure before any high temperature or solder reflow process.
The recommendation baking time for GlobalTop GPS module is as follows:
to high temperature of solder reflow, in order to prevent internal delaminating, cracking of the
devices, or the “popcorn” phenomenon, it is a necessary requirement for GlobalTop GPS module to
undergo pre-baking procedure before any high temperature or solder reflow process.
The recommendation baking time for GlobalTop GPS module is as follows:
60°C for 8 to 12 hours
Once baked, the module’s floor life will be “reset”, and has additional 72 hours in normal factory
condition to undergo solder reflow process.
Please limit the number of times the GPS modules undergoes baking processes as repeated
baking process has an effect of reducing the wetting effectiveness of the SMD pad contacts.
This applies to all SMT devices.
Oxidation Risk: Baking SMD packages may cause oxidation and/or intermetallic growth of
the terminations, which if excessive can result in solderability problems during board
assembly. The temperature and time for baking SMD packages are therefore limited by
solderability considerations. The cumulative bake time at a temperature greater than 90°C
and up to 125°C shall not exceed 96 hours. Bake temperatures higher than 125°C are now
allowed.