Intel E7520 User Manual
Dual-Core Intel
®
Xeon
®
processor LV with Intel
®
E7520 Chipset and Intel
®
6300ESB ICH
April 2007
User’s Manual
Order Number: 311274-009
25
Dual-Core Intel Xeon processor LV / E7520 Chipset / 6300ESB ICH
3.0
Theory of Operation
3.1
Block Diagram
3.2
Thermal Management
The objective of thermal management is to ensure that the temperature of each
component is maintained within specified functional limits. The functional temperature
limit is the range within which the electrical circuits may be expected to meet their
specified performance requirements. Operation outside the functional limit may
degrade system performance and cause reliability problems. The Development Kit is
shipped with heatsink thermal solutions to be installed on the processor. This thermal
solution has been tested in an open air environment at room temperature and is
sufficient for evaluation purposes. The designer must ensure that adequate thermal
management is provided for any customer-derived designs.
Figure 13.
Block Diagram of Layout
DDR2 400
Single or dual
channel support
Single or dual
channel support
LPC Bus
Intel®
E7520
(MCH)
FWH
Two SATA
Four USB (2.0) Ports
SIO
HL 1.5 Interface
PCI-X 66 MHz
PCI 32/33
R
VGA
Two IDE
Intel®
6300ESB
TPM
B
}A
C
X8 PCIe
D
D
u
u
a
a
l
l
-
-
C
C
o
o
r
r
e
e
I
I
n
n
t
t
e
e
l
l
®
®
X
X
e
e
o
o
n
n
®
®
p
p
r
r
o
o
c
c
e
e
s
s
s
s
o
o
r
r
L
L
V
V
D
D
u
u
a
a
l
l
-
-
C
C
o
o
r
r
e
e
I
I
n
n
t
t
e
e
l
l
®
®
X
X
e
e
o
o
n
n
®
®
p
p
r
r
o
o
c
c
e
e
s
s
s
s
o
o
r
r
L
L
V
V
X8 PCIe
X8 PCIe
R
R
167 MHz/667 MT/s