Intel QX9775 EU80574XL088N Data Sheet

Product codes
EU80574XL088N
Page of 90
Electrical Specifications
14
Datasheet
2.3
Decoupling Guidelines
Due to its large number of transistors and high internal clock speeds, the processor is 
capable of generating large average current swings between low and full power states. 
This may cause voltages on power planes to sag below their minimum values if bulk 
decoupling is not adequate. Larger bulk storage (C
BULK
), such as electrolytic capacitors, 
supply voltage during longer lasting changes in current demand by the component, 
such as coming out of an idle condition. Similarly, they act as a storage well for current 
when entering an idle condition from a running condition. Care must be taken in the 
baseboard design to ensure that the voltage provided to the processor remains within 
the specifications listed in 
Failure to do so can result in timing violations or 
reduced lifetime of the component.
2.3.1
V
CC 
Decoupling
Vcc regulator solutions need to provide bulk capacitance with a low Effective Series 
Resistance (ESR), and the baseboard designer must assure a low interconnect 
resistance from the regulator (EVRD or VRM pins) to the LGA771 socket. Bulk 
decoupling must be provided on the baseboard to handle large voltage swings. The 
power delivery solution must insure the voltage and current specifications are met (as 
defined in 
). 
2.3.2
V
TT
 
Decoupling
Bulk decoupling must be provided on the baseboard. Decoupling solutions must be 
sized to meet the expected load. To insure optimal performance, various factors 
associated with the power delivery solution must be considered including regulator 
type, power plane and trace sizing, and component placement. A conservative 
decoupling solution consists of a combination of low ESR bulk capacitors and high 
frequency ceramic capacitors. 
2.3.3
Front Side Bus AGTL+ Decoupling
The processor integrates signal termination on the die, as well as a portion of the 
required high frequency decoupling capacitance on the processor package. However, 
additional high frequency capacitance must be added to the baseboard to properly 
decouple the return currents from the FSB. Bulk decoupling must also be provided by 
the baseboard for proper AGTL+ bus operation.