IBM Intel Xeon E5606 49Y3775 User Manual
Product codes
49Y3775
Thermal Specifications
126
Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in
.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
Power specifications are defined at all VIDs found in
. The processor may be shipped under
multiple VIDs for each frequency.
4.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1.
The Thermal Profile is representative of a volumetrically constrained platform. Please refer to
discrete points that constitute the thermal profile.
2.
Implementation of the Thermal Profile should result in virtually no TCC activation. Utilization of thermal
solutions that do not meet the Thermal Profile will result in increased probability of TCC activation and may
incur measurable performance loss.
30
60.2
40
63.2
50
66.3
60
69.4
Table 7-14. Low Power Platform 40W Thermal Specifications
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
40
5
See
;
1, 2, 3, 4
Table 7-13. Low Power Platform 60W Thermal Profile (6 Core) (Sheet 2 of 2)
Power (W)
Maximum T
CASE
(C)
Figure 7-8. Low Power Platform 40W Thermal Profile (4 Core)
45
50
55
60
65
0
10
20
30
40
Power [W]
T
e
m
p
er
at
u
re [
C
]
Y = 0.318*x + 50.4
45
50
55
60
65
0
10
20
30
40
Power [W]
T
e
m
p
er
at
u
re [
C
]
Y = 0.318*x + 50.4