IBM Intel Xeon E5606 49Y3775 User Manual
Product codes
49Y3775
Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
127
Thermal Specifications
3.
Refer to the Intel® Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guidelines for system
and environmental implementation details.
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in
.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
Power specifications are defined at all VIDs found in
. The processor may be shipped under
multiple VIDs for each frequency.
4.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1.
The Thermal Profile is representative of a volumetrically constrained platform. Please refer to
for
discrete points that constitute the thermal profile.
Table 7-15. Low Power Platform 40W Thermal Profile (4 Core)
Power (W)
Maximum T
CASE
(C)
0
50.4
10
53.6
20
56.8
30
59.9
40
63.1
Table 7-16. LV-60W Processor Thermal Specifications
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
60
5
See
1, 2, 3, 4
Figure 7-9. LV-60W Processor Dual Thermal Profile